Senior Manager, Semiconductor Packaging & Assembly Operations

Private Advertiser; Hang Tuah Jaya; On-site; MYR 300,000 - 540,000; Full time

Job summary

Private Advertiser seeks a Senior Manager for Semiconductor Packaging & Assembly Operations to lead high-volume manufacturing for advanced packaging technologies supporting AI, data centers, industrial, automotive, and power applications. You will drive readiness, capacity, yield, and delivery performance across global partners.

You will oversee NPI-to-HVM transfers, qualification plans, and continuous improvement, leveraging SPC/DOE methods to optimize line efficiency.

Qualifications

• Bachelor’s degree in a technical discipline.
• 10+ years in semiconductor manufacturing, packaging, assembly, or operations.
• 3+ years of leadership managing manufacturing, engineering, or cross-functional teams in semiconductors.
• Proven experience leading NPI-to-HVM ramps and high-volume manufacturing operations.
• Strong understanding of package assembly processes (wire bond, flip chip, WLP, molding, SMT, MCM).
• Knowledge of yield analysis, SPC, DOE, reliability methodologies, and qualification methods.
• Experience with global OSAT partners and outsourced ecosystems.
• Track record improving yield, cycle time, throughput, and capacity utilization.
• Knowledge of quality systems and manufacturing change management.
• Excellent analytical and stakeholder management skills.

Responsibilities

• Lead day-to-day semiconductor package assembly operations across global product lines and partners.
• Drive production output, delivery commitments, and manufacturing execution to meet targets.
• Manage assembly capacity, throughput, cycle time, yield, labor/utilization, equipment utilization, and costs.
• Establish performance reviews, metrics, and escalation for predictable execution and rapid issue resolution.
• Partner with Package Engineering, Product Engineering, Quality, Supply Chain, Planning, Procurement, and Operations to optimize performance.
• Serve as primary assembly operations leader for NPI-to-production transfers and ramps.
• Develop and execute manufacturing readiness plans covering equipment, tooling, materials, labor, and capacity.
• Drive launches and scale-up while ensuring readiness milestones are achieved.
• Lead data-driven improvements to increase line output and reduce bottlenecks.
• Apply SPC/DOE/root cause analysis to resolve manufacturing challenges.
• Collaborate with Quality/Reliability to ensure compliance with standards.
• Drive continuous improvement in productivity, reliability, quality, and cost.
• Lead process change management involving materials, equipment, and factory transfers.
• Manage OSAT relationships and manufacturing partners; conduct audits and improvement initiatives.

Skills

Semiconductor leadership

NPI-to-HVM ramps

Yield optimization

SPC/DOE analysis

Global OSAT management

Manufacturing excellence

Process change management

Cross-functional collaboration

Data-driven problem solving

Education

Bachelor’s degree in Electrical/Mechanical/Industrial Engineering or related

Tools

Statistical analysis tools

Job description

Senior Manager, Semiconductor Packaging & Assembly Operations

We are seeking an experienced Senior Manager, Semiconductor IC Packaging & Assembly Operations to lead high-volume manufacturing and production ramp execution for advanced semiconductor packaging technologies supporting AI infrastructure, data center, industrial, automotive, and power applications.

This role is responsible for driving manufacturing readiness, NPI-to-HVM transfers, yield performance, capacity utilization, and operational excellence across global manufacturing and OSAT partners. The successful candidate will play a critical role in scaling qualified package technologies into predictable, high-volume production while ensuring delivery performance, product quality, and business growth objectives are achieved.

The scope includes advanced power packaging applications, including Smart Power Stages (SPS), Vertical Power Stages (VPS), Power Modules, and Discrete FET packages, as well as wide-bandgap (WBG) technologies such as SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies.

Key Responsibilities

Manufacturing & Assembly Operations Leadership

Lead day-to-day semiconductor package assembly operations across assigned global product lines and manufacturing partners.

Drive production output, customer delivery commitments, and manufacturing execution to achieve business and revenue targets.

Manage assembly capacity, throughput, cycle time, yield, labor utilization, equipment utilization, and operational cost performance.

Establish operational reviews, performance metrics, and escalation mechanisms to ensure predictable execution and rapid issue resolution.

Partner closely with Package Engineering, Product Engineering, Quality, Supply Chain Management, Planning, Procurement, and Operations teams to optimize manufacturing performance.

NPI-to-HVM & Production Ramp Execution

Serve as the primary assembly operations leader for NPI-to-production transfers and high-volume manufacturing ramps.

Develop and execute manufacturing readiness plans covering equipment, tooling, materials, labor, and capacity requirements.

Drive successful product launches and production scale-up while ensuring manufacturing readiness milestones are achieved.

Collaborate with cross-functional stakeholders to align production schedules, material readiness, and capacity plans.

Yield, Quality & Continuous Improvement

Own assembly output performance, yield monitoring, trend analysis, and corrective action execution.

Lead data-driven initiatives to increase line output, reduce bottlenecks, improve first-pass yield, and shorten manufacturing cycle time.

Apply structured problem-solving methodologies, including SPC, DOE, and root cause analysis, to resolve manufacturing challenges.

Partner with Quality and Reliability teams to ensure compliance with internal, customer, and industry standards.

Drive continuous improvement initiatives focused on productivity, reliability, quality, and cost optimization.

Process Change Management

Lead process change management activities involving materials, equipment, tooling, manufacturing flows, and site transfers.

Assess operational, quality, reliability, and supply chain impacts of engineering and manufacturing changes.

Ensure disciplined implementation of qualification plans, process controls, and change management procedures.

OSAT & Manufacturing Partner Management

Manage strategic relationships with global OSATs and contract manufacturing partners supporting development, ramp, and production.

Drive partner accountability for yield, quality, cycle time, capacity, delivery, and operational performance.

Lead operational reviews, audits, capacity assessments, and manufacturing improvement initiatives.

Support manufacturing transfers, second-source qualifications, capacity expansion programs, and cost-improvement efforts.

Leadership & Team Development

Lead, coach, and develop a high-performing global assembly engineering and manufacturing team.

Foster a culture of accountability, collaboration, technical excellence, and continuous improvement.

Build organizational capability and technical expertise to support future business growth and technology expansion.

Support talent development, succession planning, and leadership development initiatives.

About You

Required Qualifications

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Industrial Engineering, Operations Management, Supply Chain Management, or a related technical discipline.

10+ years of semiconductor manufacturing, packaging, assembly, or manufacturing operations experience.

3+ years of leadership experience managing manufacturing, engineering, operations, or cross-functional teams within semiconductor environments.

Proven experience leading NPI-to-HVM product ramps and high-volume manufacturing operations.

Strong understanding of semiconductor package assembly processes such as wire bond, flip chip, wafer-level packaging, molding, singulation, SMT, multi-chip modules, and other advanced packaging technologies.

Deep knowledge of semiconductor manufacturing yield analysis, SPC, DOE, reliability methodologies, process control systems, qualification methods, and statistical analysis tools.

Experience managing global OSAT partners and outsourced manufacturing ecosystems, including supplier selection, qualification, benchmarking, and operational management.

Demonstrated success improving yield, cycle time, throughput, capacity utilization, and manufacturing efficiency.

Strong knowledge of semiconductor quality systems, manufacturing change management, and qualification methodologies.

Excellent analytical, communication, organizational, and stakeholder management capabilities.

Preferred Qualifications

Experience in one or more of the following areas:

Power semiconductor packaging

Smart Power Stages (SPS)

Vertical Power Stages (VPS)

Power Modules

Discrete FET packaging

SiC and GaN technologies

DBC and AMB substrate technologies

Advanced packaging, heterogeneous integration, or multi-chip packaging solutions

Automotive, industrial power, AI infrastructure, high-performance computing, or data-center applications

Additionally preferred:

Master's degree or PhD in Engineering or a related technical discipline.

Experience leading geographically distributed engineering or manufacturing organizations.

Knowledge of JEDEC, IPC, and semiconductor reliability standards.

Why Join Us

Lead manufacturing execution for next-generation semiconductor technologies powering AI, data center, industrial, and automotive applications.

Drive strategic NPI-to-HVM product ramps with direct business impact.

Partner with leading global OSATs and manufacturing organizations.

Influence manufacturing strategy, capacity planning, operational excellence, and business growth.

Build and lead a world-class team supporting advanced semiconductor packaging technologies.