Senior Manager, Semiconductor Packaging & Assembly Operations

Private Advertiser; Bayan Lepas; On-site; MYR 300,000 - 420,000; Full time

Job summary

Private Advertiser in Malaysia seeks a Senior Manager to lead high-volume semiconductor IC packaging and assembly operations across global partners. You will drive manufacturing readiness, NPI-to-HVM transfers, and yield improvements while ensuring on-time delivery and product quality across AI, data center, industrial, automotive, and power applications.

The role covers advanced power packaging (SPS, VPS, power modules, Discrete FET), and wide-bandgap technologies (SiC, GaN) with DBC/AMB

Qualifications

• Bachelor's degree in a technical field.
• 10+ years in semiconductor manufacturing, packaging, assembly, or manufacturing operations.
• Leadership experience managing cross-functional teams in semiconductor environments.

Responsibilities

• Lead day-to-day semiconductor package assembly operations across global product lines and manufacturing partners.
• Drive production output, delivery commitments, and manufacturing execution to meet targets.
• Manage assembly capacity, throughput, cycle time, yield, and cost performance.
• Establish performance metrics and escalation mechanisms for predictable execution.
• Collaborate with Engineering, Quality, Supply Chain, Planning, and Operations teams to optimize performance.
• Oversee NPI-to-production transfers and high-volume manufacturing ramps.
• Develop manufacturing readiness plans covering equipment, materials, and labor needs.

Skills

Leadership

NPI to HVM

Yield analysis

Operational excellence

Cross-functional collaboration

Strategic planning

Education

Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Industrial Engineering, Operations Management, Supply Chain Management, or related technical discipline

Job description

Senior Manager, Semiconductor Packaging & Assembly Operations

We are seeking an experienced Senior Manager, Semiconductor IC Packaging & Assembly Operations to lead high-volume manufacturing and production ramp execution for advanced semiconductor packaging technologies supporting AI infrastructure, data center, industrial, automotive, and power applications.

This role is responsible for driving manufacturing readiness, NPI-to-HVM transfers, yield performance, capacity utilization, and operational excellence across global manufacturing and OSAT partners. The successful candidate will play a critical role in scaling qualified package technologies into predictable, high-volume production while ensuring delivery performance, product quality, and business growth objectives are achieved.

The scope includes advanced power packaging applications, including Smart Power Stages (SPS), Vertical Power Stages (VPS), Power Modules, and Discrete FET packages, as well as wide-bandgap (WBG) technologies such as SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies.

Key Responsibilities

Manufacturing & Assembly Operations Leadership

About the Role

We are seeking an experienced Senior Manager, Semiconductor IC Packaging & Assembly Operations to lead high-volume manufacturing and production ramp execution for advanced semiconductor packaging technologies supporting AI infrastructure, data center, industrial, automotive, and power applications.

This role is responsible for driving manufacturing readiness, NPI-to-HVM transfers, yield performance, capacity utilization, and operational excellence across global manufacturing and OSAT partners. The successful candidate will play a critical role in scaling qualified package technologies into predictable, high-volume production while ensuring delivery performance, product quality, and business growth objectives are achieved.

The scope includes advanced power packaging applications, including Smart Power Stages (SPS), Vertical Power Stages (VPS), Power Modules, and Discrete FET packages, as well as wide-bandgap (WBG) technologies such as SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies.

Key Responsibilities

Manufacturing & Assembly Operations Leadership

• Lead day-to-day semiconductor package assembly operations across assigned global product lines and manufacturing partners.

• Drive production output, customer delivery commitments, and manufacturing execution to achieve business and revenue targets.

• Manage assembly capacity, throughput, cycle time, yield, labor utilization, equipment utilization, and operational cost performance.

• Establish operational reviews, performance metrics, and escalation mechanisms to ensure predictable execution and rapid issue resolution.

• Partner closely with Package Engineering, Product Engineering, Quality, Supply Chain Management, Planning, Procurement, and Operations teams to optimize manufacturing performance.

• Serve as the primary assembly operations leader for NPI-to-production transfers and high-volume manufacturing ramps.

• Develop and execute manufacturing readiness plans covering equipment, tooling, materials, labor, and capacity requirements.

• Drive successful product launches and production scale-up while ensuring manufacturing readiness milestones are achieved.

• Collaborate with cross-functional stakeholders to align production schedules, material readiness, and capacity plans.

• Own assembly output performance, yield monitoring, trend analysis, and corrective action execution.

• Lead data-driven initiatives to increase line output, reduce bottlenecks, improve first-pass yield, and shorten manufacturing cycle time.

• Apply structured problem-solving methodologies, including SPC, DOE, and root cause analysis, to resolve manufacturing challenges.

• Partner with Quality and Reliability teams to ensure compliance with internal, customer, and industry standards.

• Drive continuous improvement initiatives focused on productivity, reliability, quality, and cost optimization.

• Lead process change management activities involving materials, equipment, tooling, manufacturing flows, and site transfers.

• Assess operational, quality, reliability, and supply chain impacts of engineering and manufacturing changes.

• Ensure disciplined implementation of qualification plans, process controls, and change management procedures.

• Manage strategic relationships with global OSATs and contract manufacturing partners supporting development, ramp, and production.

• Drive partner accountability for yield, quality, cycle time, capacity, delivery, and operational performance.

• Lead operational reviews, audits, capacity assessments, and manufacturing improvement initiatives.

• Support manufacturing transfers, second-source qualifications, capacity expansion programs, and cost-improvement efforts.

• Lead, coach, and develop a high-performing global assembly engineering and manufacturing team.

• Foster a culture of accountability, collaboration, technical excellence, and continuous improvement.

• Build organizational capability and technical expertise to support future business growth and technology expansion.

• Support talent development, succession planning, and leadership development initiatives.

About You

• Bachelor's degree in Electrical Engineering, Materials Science, Mechanical Engineering, Industrial Engineering, Operations Management, Supply Chain Management, or a related technical discipline.

• 10+ years of semiconductor manufacturing, packaging, assembly, or manufacturing operations experience.

• 3+ years of leadership experience managing manufacturing, engineering, operations, or cross-functional teams within semiconductor environments.

• Proven experience leading NPI-to-HVM product ramps and high-volume manufacturing operations.

• Strong understanding of semiconductor package assembly processes such as wire bond, flip chip, wafer-level packaging, molding, singulation, SMT, multi-chip modules, and other advanced packaging technologies.

• Deep knowledge of semiconductor manufacturing yield analysis, SPC, DOE, reliability methodologies, process control systems, qualification methods, and statistical analysis tools.

• Experience managing global OSAT partners and outsourced manufacturing ecosystems, including supplier selection, qualification, benchmarking, and operational management.

• Demonstrated success improving yield, cycle time, throughput, capacity utilization, and manufacturing efficiency.

• Strong knowledge of semiconductor quality systems, manufacturing change management, and qualification methodologies.

• Excellent analytical, communication, organizational, and stakeholder management capabilities.

Preferred Qualifications

Experience in one or more of the following areas:

• Power semiconductor packaging

• Smart Power Stages (SPS)

• Vertical Power Stages (VPS)

• Power Modules

• Discrete FET packaging

• SiC and GaN technologies

• DBC and AMB substrate technologies

• Advanced packaging, heterogeneous integration, or multi-chip packaging solutions

• Automotive, industrial power, AI infrastructure, high-performance computing, or data-center applications

Additionally preferred:

• Master's degree or PhD in Engineering or a related technical discipline.

• Experience leading geographically distributed engineering or manufacturing organizations.

• Knowledge of JEDEC, IPC, and semiconductor reliability standards.

Why Join Us

• Lead manufacturing execution for next-generation semiconductor technologies powering AI, data center, industrial, and automotive applications.

• Drive strategic NPI-to-HVM product ramps with direct business impact.

• Partner with leading global OSATs and manufacturing organizations.

• Influence manufacturing strategy, capacity planning, operational excellence, and business growth.

• Build and lead a world-class team supporting advanced semiconductor packaging technologies.