Principal TPM Engineer – Semiconductors

Microchip Technology; Bayan Lepas; On-site; MYR 180,000 - 340,000; Full time

Job summary

Microchip Technology in Penang, Malaysia, seeks a Principal Engineer - Technical Program Management to lead cross-functional programs across IP and SOC development. You will coordinate Design, Implementation, DFT, Layout, CAD, and Mixed-Signal teams across multiple time zones to deliver complex projects.

You will plan, develop and track tasks across CAD flow, vendor tools, and Post-Si tests while establishing risk management and stakeholder visibility.

Qualifications

• BS/MS in Electrical/Electronics Engineering or equivalent.
• 10+ years in semiconductors including backend deliverables (Synthesis/DFT/Layout/Physical Verification/Reliability/Flow Development).
• Experience in two or more semiconductor backend functions is required.
• Proficient with project management tools like JIRA and Agile methodologies.
• Excellent verbal and written communication skills.
• Effective team player, capable of cross-functional collaboration and motivating teams.
• Ability to operate in multi-location, cross-functional teams.

Responsibilities

• Coordinate tasks across IP and SOC development with Design, Implementation, DFT, Layout, CAD and Mixed Signal teams.
• Plan and track tasks across IP/SOC development, CAD flow, vendor tools, and Post-Si tests.
• Establish and facilitate risk management for new projects with internal stakeholders.
• Lead periodic status meetings and align inter-team activities.
• Present project status to internal/external customers and incorporate feedback.
• Ensure goals are met in customer satisfaction and quality.

Skills

Project management

Communication

Team collaboration

Cross-functional teamwork

Education

BS/MS degree in Electrical/Electronics Engineering

Tools

JIRA

Job description

Microchip Technology in Penang, Malaysia, seeks a Principal Engineer - Technical Program Management to lead cross-functional programs across IP and SOC development. You will coordinate Design, Implementation, DFT, Layout, CAD, and Mixed-Signal teams across multiple time zones to deliver complex projects.

You will plan, develop and track tasks across CAD flow, vendor tools, and Post-Si tests while establishing risk management and stakeholder visibility.