Plating Process Engineer: Yield, Throughput & Tech Transfer

Nexperia; Seremban; On-site; MYR 150,000 - 200,000; Full time

Job summary

Nexperia in Malaysia seeks an Equipment & Process Engineer (Plating) to sustain BIM (RTR) plating with emphasis on high yield and process stability. You will drive improvements, troubleshoot defects, and support transfer of new tech into HVM while collaborating with equipment, R&D, QA, and product teams.

Ideal candidates have 3+ years in semiconductor plating, hands-on equipment experience, and strong data-analysis skills.

Qualifications

• Bachelor’s degree in engineering (Chemical preferred).
• 3+ years in semiconductor manufacturing, with plating/wet processes.
• Hands-on plating equipment experience; MECO lines a plus.
• Strong knowledge of plating, chemistry, and defect troubleshooting.
• Experience with JMP or Minitab for data analysis.
• Excellent documentation and cross-functional collaboration.
• Thrives in fast-paced, high-volume environments.
• Experience with BIM/RTR plating lines is preferred.
• Exposure to advanced packaging is a plus.
• Proven track record in yield improvement and process optimization.

Responsibilities

• Own and sustain BIM (RTR) plating processes and equipment for high yield.
• Drive yield, quality, throughput, and cost-reduction initiatives.
• Identify process variations via data-driven analysis.
• Lead LOH disposition and provide floor support to operations.
• Collaborate with Equipment, R&D, NPI, QA, and Product teams.
• Support technology transfer into high-volume manufacturing.
• Maintain SOPs, control plans, FMEAs, and process specs.
• Coordinate with suppliers on plating equipment and parts.
• Mentor technicians and support 24/7 operations.
• Ensure compliance with EHS and chemical handling standards.

Skills

Semiconductor plating

Statistical analysis

Cross-functional collaboration

Documentation skills

Equipment handling

Education

Bachelor’s degree in engineering

Tools

JMP

Minitab

MECO plating lines

Job description

Nexperia in Malaysia seeks an Equipment & Process Engineer (Plating) to sustain BIM (RTR) plating with emphasis on high yield and process stability. You will drive improvements, troubleshoot defects, and support transfer of new tech into HVM while collaborating with equipment, R&D, QA, and product teams.

Ideal candidates have 3+ years in semiconductor plating, hands-on equipment experience, and strong data-analysis skills.