Platform SI/PI Lead: High-Speed Hardware Architect

Intel Corporation

Penang

Vor Ort

MYR 180.000 - 300.000

Vollzeit

Vor 4 Tagen
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Zusammenfassung

Intel Corporation in Penang, Malaysia is seeking a Platform Signal/Power Integrity Engineer Lead to define, develop, and deliver SI/PI solutions for next‑gen validation and product platforms. You will provide technical leadership across electrical architecture, high‑speed interfaces, schematic reviews, PCB layout, and validation.

You will collaborate with silicon, package, PCB, firmware, validation, and manufacturing teams to ensure robust designs meeting electrical and power delivery targets.

Qualifikationen

  • 9+ years in Signal Integrity, Power Integrity, or platform hardware design.
  • Strong high-speed digital design understanding and PDN analysis.
  • Hands-on schematic review and board-level electrical analysis.
  • Experience with high-speed interfaces and IC/package interconnects.

Aufgaben

  • Lead SI/PI activities for complex platform, board, and package designs.
  • Perform pre-layout and post-layout SI/PI simulations and analysis.
  • Develop electrical budgets and design margin requirements for high-speed interfaces.
  • Correlate simulation results with lab measurements and validation data.
  • Define routing guidelines and review platform electrical architecture.
  • Mentor engineers in SI/PI methodology and debugging techniques.

Kenntnisse

Signal Integrity
Power Integrity
High-speed PCB design
Schematic review
SI/PI methodologies

Ausbildung

Bachelor's/Master's/PhD in Electrical Engineering

Tools

Cadence Sigrity
Cadence Allegro
ANSYS HFSS
ANSYS SIwave
ADS/SPICE tools

Jobbeschreibung

Intel Corporation in Penang, Malaysia is seeking a Platform Signal/Power Integrity Engineer Lead to define, develop, and deliver SI/PI solutions for next‑gen validation and product platforms. You will provide technical leadership across electrical architecture, high‑speed interfaces, schematic reviews, PCB layout, and validation.

You will collaborate with silicon, package, PCB, firmware, validation, and manufacturing teams to ensure robust designs meeting electrical and power delivery targets.

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