NPI Senior Engineer - Assembly Process

Renesas Electronics Corp.; Bayan Lepas; On-site; MYR 78,000 - 134,000; Full time

Job summary

Renesas Electronics Corp. in Penang, Bayan Lepas, is seeking an engineer to drive NPI activities and optimize new device processes. You will lead process window studies, assess risks, evaluate new materials, perform failure analysis, and oversee prototype sample builds.

The role requires a degree in engineering or science, with experience in semiconductor assembly/manufacturing or pre-assembly processes. Strong supervision-free work capability and solid project management are essential for

Qualifications

• Degree in Engineering/Science is required.
• Experience in semiconductor assembly/manufacturing or pre-assembly processes is an advantage.
• Strong ability to work with minimal supervision.
• Good project management and problem-solving skills.

Responsibilities

• Lead & drive NPI activities.
• Responsible for new device process window study.
• Perform risk assessment & identify technical challenges.
• New material characteristic study & evaluation.
• Failure analysis & reporting.
• Prototype sample build & characteristic check.
• Propose process condition for mass production.

Skills

NPI activities

Risk assessment

Problem solving

Project management

Education

Degree in Engineering/Science

Job description

Involving in new product setup, process optimization, device qualification & prototype sample build.

Key Responsibilities

• Lead & drive NPI activities
• Responsible for new device process window study
• Perform risk assessment & identify technical challenges
• New material characteristic study & evaluation
• Failure analysis & reporting
• Prototype sample build & characteristic check
• Propose process condition for mass production

Job Description

Job Summary

Involving in new product setup, process optimization, device qualification & prototype sample build.

Key Responsibilities

• Lead & drive NPI activities
• Responsible for new device process window study
• Perform risk assessment & identify technical challenges
• New material characteristic study & evaluation
• Failure analysis & reporting
• Prototype sample build & characteristic check
• Propose process condition for mass production

Qualifications

• Degree in Engineering/Science Discipline
• Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly process (Wafer Backgrind/Dicing, Screen Print, Die & Clip Attached, Wire Bonding, molding & cutting) is an advantage.
• Ability to work with minimal supervision
• Good project management skills
• Strong problem-solving skills

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.