FOL Process Engineering Lead / Manager – Pre-Assembly, Die Attach & Wire Bond

STMicroelectronics Sdn Bhd; Muar; On-site; MYR 180,000 - 300,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Sports (Gym)

Parking

Year-end bonus

Job summary

STMicroelectronics Sdn Bhd is seeking an experienced lead for the Panel Level Packaging Assembly Process in Malaysia. You will monitor yield performance in collaboration with process owners and manage carrier plate preparation to ensure quality and controlled circulation.

You will drive process robustness through poka-yoke solutions, preventive actions, and robust systems, while working with Operations, Equipment and Quality to minimize disruptions and support business priorities.

Qualifications

• Master’s or Bachelor’s degree in Engineering in Mechanical, Mechatronics, Manufacturing, Materials Science or Chemical engineering.
• 10+ years of working experience.
• Experience leading a large team.
• Proficient in cross-functional collaboration and problem-solving.

Responsibilities

• Lead the Panel Level Packaging Assembly Process.
• Monitor and drive yield performance with process owners.
• Manage carrier plate preparation processes for quality and circulation control.
• Drive process robustness via poka-yoke, preventive actions and robust systems.
• Collaborate with Operations, Equipment and Quality to resolve production issues and reduce line disruptions.
• Perform FMEA and risk assessments for process changes.
• Manage recipe and procedural controls (Control Plan, OCAP, WI, FMEA).
• Ensure process robustness using SPC and other control tools.
• Drive cost reduction and quality improvement initiatives.

Skills

Team leadership

Communication skills

Analytical thinking

8D DMAIC

Process mapping

Fishbone analysis

Continuous improvement

Education

Engineering degree

Job description

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE

• Lead the overall Panel Level Packaging Assembly Process
• Monitor, analyze, and drive yield performance in collaboration with process owners to support yield improvement
• Manage carrier plate preparation processes to ensure proper quality and circulation control
• Drive process robustness through poka-yoke solutions, preventive actions, and robust systems to minimize human error
• Work closely with Operations, Equipment, and Quality teams to resolve production and quality issues, and to reduce line disruptions while maintaining business priorities
• Perform FMEA and risk assessments for process changes through proper change management
• Manage recipe and procedural control, with familiarity in Control Plan, OCAP, Work Instruction (WI), and FMEA
• Ensure process robustness through the use of SPC and other process control tools
• Drive excursion prevention, cost reduction, and quality improvement initiatives

YOUR SKILLS & EXPERIENCES

• Master’s or Bachelor’s degree in Engineering such as Mechanical, Mechatronics, Manufacturing, Material Science, Chemical, or a related field
• More than 10 years of working experience
• Experience in leading a large team is a must
• Strong communication and analytical skills
• Solid problem-solving skills using structured methodologies such as 8D, DMAIC, Process Mapping, and Fishbone analysis
• Ability to anticipate issues, resolve challenges quickly, and support production operations effectively
• Strong execution skills and ability to work in a fast-paced environment
• Proven ability to lead and coach engineers and technicians
• Strong teamwork, leadership, and continuous improvement mindset

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.

Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!

At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.

Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!

Perks and benefits Medical Education support Dental Sports (e.g. Gym) Parking car loan interest subsidies, year-end bonus, perfo

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