Turn this role into an interview — a resume and cover letter built around what this employer wants.
Texas Instruments in Malaysia is seeking an Equipment Engineer to drive MES-enabled transformation for End-of-Line Mold and Symbol Trim Form operations. The role starts with a 1-month TI orientation, then 1–2 years on an EOL MES implementation project before transitioning to a production position focused on uptime and automation in a high-volume environment.
You will define equipment workflows, support qualification, and validate MES integration; post-project, you will sustain reliability,
Change the world. Love your job.
Join TI as a specialized Equipment Engineer to drive the digital transformation of our to drive the digital transformation of our End-of-Line (EOL) manufacturing, specifically covering Mold and Symbol Trim Form (STF) operations. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.
MES Implementation (Project Phase): Represent EOL Equipment Engineering in the MES rollout. Define equipment workflows, setup/recipe controls, qualification requirements, equipment states, and interlocks for both Mold and STF machines.
Digital Integration: Translate physical shop-floor requirements (e.g., Mold cure/pressure/temp and STF mechanical/trimming parameters) into digital process designs and data collection needs.
Validation: Validate equipment integration scenarios and support User Acceptance Testing (UAT) and deployment for both process areas.
Sustaining (Post-Project Phase): Transition to production to manage equipment reliability, troubleshoot MES-related equipment issues, and drive continuous improvement in automation and uptime.
Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)
Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here (https://careers.ti.com/en/sites/CX/pages/benefits)
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
Strong hands‑on semiconductor equipment experience in with Mold equipment (e.g., Towa, ASM) AND/OR Symbol Trim Form equipment (e.g., ASM, Besi) with minimum 2 years of relevant experience
Experience with tool monitoring/interdiction software and SPC techniques.
Experience working with MES platforms , whether Siemens OpCenter or another comparable MES product modeling or configuration
Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and elevate early
Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
Strong verbal and written communication skills
Demonstrated strong analytical, critical thinking and problem solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on‑time project delivery
Ability to work effectively in an interrupt‑driven, fast‑paced and rapidly changing environment
Demonstrated ability to build strong, influential relationship
Yes