Mold and Symbol Trim Form (EOL) Equipment Engineer (MES Project)

Texas Instruments

Kuala Lumpur

On-site

MYR 120,000 - 180,000

Full time

6 days ago
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Job summary

Texas Instruments in Malaysia is seeking an Equipment Engineer to drive MES-enabled transformation for End-of-Line Mold and Symbol Trim Form operations. The role starts with a 1-month TI orientation, then 1–2 years on an EOL MES implementation project before transitioning to a production position focused on uptime and automation in a high-volume environment.

You will define equipment workflows, support qualification, and validate MES integration; post-project, you will sustain reliability,

Qualifications

  • Bachelor's degree in Electrical, ECE, Chemical, Mechanical or Materials Science engineering or related field.
  • Strong hands-on semiconductor equipment experience with Mold equipment and/or Symbol Trim Form equipment (minimum 2 years).
  • Experience with MES platforms and data-driven process validation is preferred.

Responsibilities

  • Represent EOL Equipment Engineering in MES rollout and define equipment workflows.
  • Translate shop-floor requirements into digital process designs and data collection needs.
  • Validate equipment integration and support UAT and deployment for Mold and STF.
  • Post-project, transition to production to manage reliability and uptime improvements.

Skills

Communication
Teamwork
Initiative
Time management
Problem solving
Analytical thinking
Adaptability

Education

Bachelor's degree in Electrical Engineering or related

Tools

MES platforms (Siemens OpCenter)

Job description

Change the world. Love your job.

Join TI as a specialized Equipment Engineer to drive the digital transformation of our to drive the digital transformation of our End-of-Line (EOL) manufacturing, specifically covering Mold and Symbol Trim Form (STF) operations. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities:
  • MES Implementation (Project Phase): Represent EOL Equipment Engineering in the MES rollout. Define equipment workflows, setup/recipe controls, qualification requirements, equipment states, and interlocks for both Mold and STF machines.

  • Digital Integration: Translate physical shop-floor requirements (e.g., Mold cure/pressure/temp and STF mechanical/trimming parameters) into digital process designs and data collection needs.

  • Validation: Validate equipment integration scenarios and support User Acceptance Testing (UAT) and deployment for both process areas.

  • Sustaining (Post-Project Phase): Transition to production to manage equipment reliability, troubleshoot MES-related equipment issues, and drive continuous improvement in automation and uptime.

Why TI?
  • Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.

  • We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI (https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012)

  • Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here (https://careers.ti.com/en/sites/CX/pages/benefits)

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

Minimum Requirements:
  • Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree

  • Strong hands‑on semiconductor equipment experience in with Mold equipment (e.g., Towa, ASM) AND/OR Symbol Trim Form equipment (e.g., ASM, Besi) with minimum 2 years of relevant experience

Preferred Qualifications:
  • Experience with tool monitoring/interdiction software and SPC techniques.

  • Experience working with MES platforms , whether Siemens OpCenter or another comparable MES product modeling or configuration

  • Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and elevate early

  • Experience on tool monitoring and interdiction software, and equipment maintenance and documentation

  • Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.

  • Strong verbal and written communication skills

  • Demonstrated strong analytical, critical thinking and problem solving skills

  • Ability to work in teams and collaborate effectively with people in different functions

  • Ability to take the initiative and drive for results

  • Strong time management skills that enable on‑time project delivery

  • Ability to work effectively in an interrupt‑driven, fast‑paced and rapidly changing environment

  • Demonstrated ability to build strong, influential relationship

ECL/GTC Required:

Yes

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