Laser Engineer

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD.; Johor; On-site; MYR 60,000 - 100,000; Full time

Job summary

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD. is seeking a skilled Laser Process Engineer to develop and optimize laser marking, cutting, and trenching processes for advanced semiconductor products.

This role focuses on improving production yield and establishing robust laser process standards. You will define laser paths, energy parameters, and positioning methods, prepare process instructions and inspection standards, and collaborate with engineering, production, and quality teams to validate

Qualifications

• Requires Diploma or Bachelor's in Mechanical, Electrical, Electronics, Mechatronics, Materials Engineering, or related discipline.
• Minimum 3 years of laser process or semiconductor manufacturing experience.
• Experience with laser marking, cutting, trenching, programming, parameter optimization, and process validation.
• Experience in semiconductor packaging, SiP, SMT, PCB, or precision manufacturing is preferred.

Responsibilities

• Develop laser marking, cutting, and trenching programs to meet dimensional, cosmetic, manufacturability, and reliability requirements.
• Define laser paths, energy parameters, and positioning methods for serial numbers, logos, text, and other product markings.
• Prepare detailed routing logic, process instructions, specifications, inspection standards, and checklists.
• Optimize laser process designs based on feedback from engineering, production, and quality teams.
• Troubleshoot production defects, including penetration, residue, delamination, misalignment, and inconsistent marking.
• Work with automation and production teams to conduct trials, validate processes, and support mass-production implementation.
• Lead root-cause analysis, corrective actions, and continuous improvement activities to increase process stability and product yield.
• Participate in customer technical discussions and evaluate laser technologies.

Skills

Laser process development

Problem solving

Communication skills

Team collaboration

Education

Bachelor's degree in Engineering

Tools

DOE

PFMEA

SPC

Job description

LONGCHEER TECHNOLOGY (MALAYSIA) SDN. BHD.

We are seeking a skilled Laser Process Engineer to develop and optimize laser marking, cutting, and trenching processes for advanced semiconductor products. This role offers the opportunity to support new product introduction, improve production yield, and establish robust laser process standards.

Key responsibilities

Develop laser marking, cutting, and trenching programs to meet dimensional, cosmetic, manufacturability, and reliability requirements.

Define laser paths, energy parameters, and positioning methods for serial numbers, logos, text, and other product markings.

Prepare detailed routing logic, process instructions, specifications, inspection standards, and checklists.

Optimize laser process designs based on feedback from engineering, production, and quality teams.

Troubleshoot production defects, including penetration, residue, delamination, misalignment, and inconsistent marking.

Work closely with automation and production teams to conduct trials, validate processes, and support mass-production implementation.

Lead root-cause analysis, corrective actions, and continuous improvement activities to increase process stability and product yield.

Participate in customer technical discussions and evaluate the suitability, advantages, and limitations of different laser technologies.

Establish process risk-assessment mechanisms and continuously strengthen process standardization.

About you

Diploma or bachelor's degree in Mechanical, Electrical, Electronics, Mechatronics, Materials Engineering, or a related discipline.

At least 3 years of relevant laser process or semiconductor manufacturing experience.

Practical knowledge of laser marking, cutting, trenching, programming, parameter optimization, and process validation.

Experience in semiconductor packaging, SiP, SMT, PCB, or precision manufacturing is preferred.

Strong problem-solving skills with experience handling laser-related defects and yield improvement.

Familiarity with DOE, PFMEA, SPC, control plans, and root-cause analysis tools is an advantage.

Able to work effectively with customers and cross-functional teams.

Good communication skills in English; Mandarin proficiency is an added advantage.