Engineering Intern — Smart Manufacturing & Data Analytics

HP

Kampung Sekolah Simpang Ampat

On-site

MYR 8,900 - 17,000

Full time

14 days+

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Job summary

HP is offering a College Intern - Engineering position attached to the Smart Manufacturing group in Malaysia. Interns will engage in process and equipment follow-up, improve tooling performance, analyze yield and throughput, and participate in product testing and failure analysis.

Ideal candidates are pursuing a Bachelor’s degree in Mechanical, Electronic/Electrical, Mechatronic, Manufacturing, or Materials Science, with internships starting after Nov 2026 or in 2027, strong analytical and data

Qualifications

Excellent analytical thinking and data analytic.
Fundamental knowledge of statistics and probability or data analytic.
Good visualization skills to create real-time dashboards and/or reports to inform trends and insights.
Problem solving skill.

Responsibilities

Involve in process & equipment technical and engineering follow up; manage and work on improve process and tooling performance from quality, yield, machine-up time, process characterization, OEE and throughput; work on product failure analysis or product testing.
Work on process and product characterization or improvements
Innovate on new forms of manufacturing technology in line with Industrial 4.0.
Work on projects assigned based on your course background & interest.