Defect Review Technician (Contract)

Intel Corporation

George Town

Sur place

MYR 39 000 - 61 000

Plein temps

Il y a 2 jours
Soyez parmi les premiers à postuler

Une candidature complète en une minute

Un CV et une lettre de motivation personnalisés, prêts à envoyer.

Passez les filtres ATS

Résumé du poste

Intel Corporation in Malaysia is seeking a Defect Review Technician to join the Advanced Packaging Command Center (APCC) in Penang. You will classify defects, validate classifications, and help hold-lot disposition with a focus on quality and manufacturing efficiency across global operations.

The role requires a Diploma in Engineering or Science, willingness to rotate shifts, strong English, and the ability to review inspection images across multiple platforms.

Qualifications

  • Diploma in Engineering or related manufacturing disciplines required.
  • Diploma in Science Stream with IT/Physics/Maths recommended.
  • Willingness to rotate shifts to provide global coverage.
  • Strong English communication skills in reading, writing, and speaking.
  • Proficiency with computer-based work and handling inspection images.
  • Ability to work at a workstation for long periods with focus.

Responsabilités

  • Defect Classification and Analysis: Review defect images and classify defects per specs.
  • Defect Validation: Verify classifications against criteria and partner with Layer Owner.
  • Hold Lot Disposition: Ensure proper disposition decisions with OCAP documentation.
  • First Level Defect Analysis: Provide initial technical review and document findings.

Connaissances

English proficiency
Shift work
Computer-based work

Formation

Diploma in Engineering (Manufacturing, Mechatronics, Semiconductor Technology, Electronics, Mechanical or related disciplines)
Diploma in Science Stream (Computer Science, IT, Physics, Chemistry, Mathematics & Statistics or related)

Description du poste

Job Details:
Job Description:

Be a part of Intel's Advanced Packaging Command Center (APCC), the global command center for Advanced Packaging that provides remote capabilities, follow‑on engineering, and operational support across Wafer Packaging Manufacturing (WPM). Through APCC, engineering expertise is focused to improve coordination across regions, drive standardization, and improve responsiveness, while strengthening end‑to‑end operational execution across regions and delivering consistent, high‑quality execution at scale.

As the defect review technician, you will be instrumental in supporting global defect review activities, including defect classification, validation, and hold lot disposition. You will help maintain quality excellence while contributing to APCC's mission of delivering standardized, high‑quality execution at scale. Your primary focus will be the accurate classification of defects captured by multiple inspection systems. Through precise defect classification, you will play a vital role in minimizing defect noise, driving systematic defect reduction initiatives, and maintaining the optimal balance between quality control and manufacturing efficiency.

Responsibilities will include but are not limited to
Defect Classification and Analysis:
  • Review and Analyze defect images captured by diverse metrology tools.
  • Accurately classify defects based on documented defect specification.
  • Distinguish between true defects requiring disposition action and false positives or nuisance defects.
  • Maintain proficiency across multiple inspection platforms and adapt classification criteria to different tool capabilities and imaging conditions
Defect Validation:
  • Verify defect classifications against established criteria and specifications
  • Partner with Layer Owner to ensure consistent defect categorization approaches
  • Prevent over‑rejection scenarios by accurately identifying non‑critical defects and cosmetic variations that do not impact product performance.
  • Avoid under‑rejection situations by ensuring killed defects are properly identified and flagged for disposition.
Hold Lot Disposition:
  • Ensure strict compliance in review and disposition of hold lots based on documented Out‑of‑Control Action Plans (OCAP)
  • Ensure proper documentation and traceability of all disposition decisions.
  • Collaborate with Layer Owner to update and refine OCAP procedures based on emerging defect patterns
  • First Level Defect Analysis
  • Perform comprehensive first level defect analysis as the initial point of technical review for all flagged defects.
  • Document initial findings and recommendations to support Layer Owner analysis and decision‑making processes.
Qualifications:
  • Diploma in Engineering ( Manufacturing, Mechatronics, Semiconductor Technology, Electronics, Mechanical or related disciplines), Diploma in Science Stream (Computer Science, Information Technology (IT), Physics, Chemistry, Mathematics & Statistics or related disciplines)
  • Ability to work rotating shifts to provide continuous support across global manufacturing operations.
  • Strong English communication skills, including reading, writing, and verbal communication.
  • Proficiency in computer‑based work and ability to maintain focus and accuracy while reviewing large volumes of inspection images.
  • Ability to work at a workstation for extended periods while maintaining attention to detail and review quality.
Preferred Qualifications:
  • 1+ years of working experience in semiconductor manufacturing, wafer fabrication, advanced packaging, metrology, inspection, quality, or manufacturing operations environments.
  • Fresh graduates are encouraged to apply.
  • High attention to detail and commitment to quality standards.
  • Effective communication and teamwork skills in a global, cross‑functional environment.
  • Willingness to learn new technologies, inspection platforms, and manufacturing processes.

We're excited to welcome passionate individuals who are ready to bring their skills and energy to Intel's dynamic environment. Take this opportunity to be part of a team that values growth, collaboration, and innovation.

Job Type:

Intel Contract Employee

Shift:

Shift 9 A1 (Malaysia)

Primary Location:

Malaysia, Penang

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on‑site presence.

Obtenez votre examen gratuit et confidentiel de votre CV.

ou faites glisser et déposez votre fichier ici.

Similar jobs

Postes similaires à comparer

Defect Review Technician (Contract)
Defect Review Technician (Contract)

Intel Corporation • Penang

Sur place
MYR 36 000 - 48 000
Defect Review Technician (Contract)
Defect Review Technician (Contract)

Intel Technology Sdn. Bhd. • Bayan Lepas

Sur place
MYR 42 000 - 66 000
Medical
Miscellaneous allowance
Education support
+6
Defect Review Technician - Semiconductor Quality
Defect Review Technician - Semiconductor Quality

Intel Corporation • George Town

Sur place
MYR 39 000 - 61 000
Remote Operations Center Manufacturing Technician (Contract)
Remote Operations Center Manufacturing Technician (Contract)

Intel Corporation • George Town

À distance
MYR 89 000 - 123 000
Defect Review Specialist – Semiconductor Quality
Defect Review Specialist – Semiconductor Quality

Intel Technology Sdn. Bhd. • Bayan Lepas

Sur place
MYR 42 000 - 66 000
Medical
Miscellaneous allowance
Education support
+6
Remote Operations Center Manufacturing Technician (Contract)
Remote Operations Center Manufacturing Technician (Contract)

Intel Corporation • Penang

À distance
MYR 54 000 - 84 000
Semiconductor Defect Review Specialist
Semiconductor Defect Review Specialist

Intel Corporation • Penang

Sur place
MYR 36 000 - 48 000
Manufacturing Operations Manager (Contract)
Manufacturing Operations Manager (Contract)

Intel • Kulim

Sur place
MYR 60 000 - 90 000
Module Engineer (Contract)
Module Engineer (Contract)

Intel Corporation • Malaisie

Sur place
MYR 60 000 - 120 000
Quality and Reliability Engineer (Advance Packaging & Assembly)
Quality and Reliability Engineer (Advance Packaging & Assembly)

Intel Corporation • Seberang Perai

Sur place
MYR 120 000 - 180 000