CPU-SoC Structural Design Engineer

Intel Corporation; Penang; Hybrid; MYR 60,000 - 95,000; Full time

Job summary

Intel Corporation in Malaysia, Penang, is seeking a Physical Design Engineer to implement and verify complex structural designs for next-generation client CPU SoCs. You will work on synthesis, floor planning, power-grid design, and timing analysis within SPE.

The role supports hybrid work, and the team collaborates across disciplines to deliver cutting-edge semiconductor solutions for hyperscale computing. Fresh graduates with relevant internships or coursework are encouraged to apply.

Qualifications

• Hands-on experience in physical design processes gained via internships, projects, or coursework.
• Knowledge of DFM, DRC, and RC extraction is preferred.
• Exposure to EDA tools for synthesis and PnR.

Responsibilities

• Implement structural physical designs, including synthesis, floor planning, power-grid, and clock tree designs.
• Perform place-and-route (PnR), static timing analysis (STA), and timing closure.
• Verify designs with FEV, PV, signal integrity/noise, and design rule checks.
• Collaborate with cross-functional teams to develop design flows and methodologies.

Skills

Physical design basics

Synthesis/Place-and-Route knowledge

Timing analysis basics

Education

Bachelor's degree in Electronic, Electrical, or Computer Engineering

Master's degree in Electronic, Electrical, or Computer Engineering

Job description

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a key role in implementing and verifying complex structural physical designs for Intel's next-generation Client CPU System-on-Chip (SoC). Your work will involve tasks such as synthesis, floor planning, power-grid designs, place-and-route, and timing analysis. This role is instrumental in ensuring the delivery of advanced SoC designs using cutting-edge process technologies in the era of hyperscale computing. Business Group You will join the Silicon and Platform Engineering Group (SPE), a global team responsible for designing and delivering leading-edge silicon solutions. The group plays a pivotal role in enabling Intel's leadership in semiconductor technology by innovating advanced design processes and methodologies that form the foundation of Intel's product excellence.

Key Responsibilities

• Implement structural physical designs, including synthesis, floor planning, power-grid, and clock tree designs.
• Perform place-and-route (PnR), static timing analysis (STA), timing budgeting, and closure.
• Conduct RC extraction, design-for-manufacturability (DFM) analysis, and design rule check (DRC) clean-up.
• Verify physical designs using functional equivalency verification (FEV), timing/performance verification (PV), signal integrity/noise analysis, layout design rules verification (LV), and reliability verification (RV).
• Optimize power usage and ensure convergence during the design process.
• Collaborate with cross-functional teams to define structural design methodologies and develop innovative design flows.

Qualifications

Minimum Qualifications

• Bachelor's degree in Electronic, Electrical, or Computer Engineering or equivalent with 0-1 years of hands-on experience in physical design, showcasing skills developed through internships, academic projects, coursework, or hands-on training.
• OR Master's degree in Electronic, Electrical, or Computer Engineering or equivalent with no prior professional experience.
• Proficiency in industrial Electronic Design Automation (EDA) tools, including tools for synthesis, place-and-route, and timing analysis.
• Demonstrated knowledge of physical design processes such as DFM, STA, RC extraction, DRC cleanup, and power-grid optimization.

Preferred Qualifications

• Familiarity with advanced semiconductor process technologies.
• Strong analytical and problem-solving skills to address design challenges.
• Effective communication and collaboration abilities to work within cross-functional teams.

Join our innovative team and contribute to the cutting-edge technologies driving the future of hyperscale computing and CPU designs. Make an impact through your skills, creativity, and passion for evolving semiconductor solutions.

Job Type: College Grad Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Penang Additional Locations:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A

Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.