Automation Software Engineering Manager (Machinery)

NSW Automation Sdn Bhd; Penang; On-site; MYR 170,000 - 220,000; Full time

Job summary

A technology leader in automation solutions is seeking an Automation Software Engineering Manager to lead the development of advanced software platforms for semiconductor and electronics packaging. The ideal candidate will have over 10 years of experience in software engineering, including 5 years in a leadership role, with strong expertise in C#, C++, and real-time control systems. This role involves strategic leadership, technical innovation, and managing high-performance teams for cutting-edge automation solutions in Malaysia, Penang.

Qualifications

• 10+ years of software engineering experience in semiconductor equipment.
• 5 years in a leadership role with a proven track record.
• Hands-on experience with motion controllers and vision systems.

Responsibilities

• Lead the design and development of advanced automation software platforms.
• Define the software roadmap for advanced packaging processes.
• Mentor and grow a team of software engineers.

Skills

C#

C++

.NET/WPF

Python

Real-time control

Machine vision

Data analytics

Deterministic motion planning

PLC communication

Job description

Automation Software Engineering Manager (Machinery)

The Manager, Automation Software Engineering leads the strategic design and development of advanced automation software platforms for semiconductor and electronics packaging equipment. This role drives innovation in motion control, vision system, data analytics, and process integration for high-precision dispensing, wafer-level packaging applications and relevant automation.

1. Strategic & Technical Leadership

Define the software and control technology roadmap supporting advanced packaging processes such as underfill jetting, TIM dispensing, flip-chip, chiplet‑to‑interposer bonding, and wafer‑to‑wafer hybrid integration.

Lead multi-disciplinary teams in software architecture, motion control, computer vision, and data analytics for high-precision automation platforms.

Align software development priorities with corporate R&D goals in sub‑10‑micron EHD jetting and multi‑nozzle MEMS printhead systems.

Mentor and grow a high-performing team of software engineers capable of supporting complex mechatronic and process-driven systems.

2. Software Architecture & System Integration

Architect modular, scalable, and reusable software frameworks that unify motion, vision, jetting, and AI feedback across NSW product lines.

Ensure deterministic real-time control for multi-axis motion, synchronized jetting, and droplet metrology with sub‑micron accuracy.

Lead integration of process modules such as flux cleaning, plasma, curing, and inspection into unified automation platforms.

Oversee communication layer design using EtherCAT, OPC‑UA, Modbus, and proprietary protocols to ensure interoperability across machine subsystems.

3. Product Development & Execution

Translate semiconductor and packaging process requirements into executable software deliverables.

Oversee the development of intuitive HMIs, data logging, recipe management, and closed-loop control systems.

Manage concurrent software projects supporting new product introductions and customer-specific customizations.

Collaborate with process, mechanical, and electrical engineering teams to ensure cohesive system performance and manufacturability.

Drive joint-development projects with OEMs, controller vendors, and automation partners to accelerate system integration and feature enhancement.

4. Advanced Packaging Process Enablement

Work closely with process and customer to implement AI/ML algorithms for related process control.

Lead software development for inline inspection and metrology systems (vision-based droplet detection, alignment correction, defect mapping).

Support new applications in fan-out wafer-level packaging (FOWLP), chiplet integration, and advanced underfill through software-driven process control.

Guide the digital transformation of equipment integrating MES/SECS-GEM, traceability, and predictive maintenance capabilities.

5. Innovation, Quality & Compliance

Drive continuous improvement in software lifecycle, validation, and risk control and SEMI standards.

Establish robust testing frameworks, regression validation, and field-upgrade systems to ensure uptime and process reliability.

Promote a culture of innovation and intellectual property generation through advanced algorithms, control logic, and UI/UX innovations.

Technical Skills

Strong expertise in C#, C++, .NET/WPF, and Python.

Proficient in real-time control, deterministic motion planning, and PLC communication.

Knowledge of machine vision, data analytics, and cloud-connected systems.

Understanding of wafer handling, die attach, underfill, and hybrid bonding process integration.

Experience deploying AI/ML-based process monitoring or adaptive control is a plus.

Requirements

At least 10 years of software engineering experience in semiconductor equipment, advanced packaging, or high-precision automation, with 5 years in leadership role.

Proven track record in real-time control, motion systems, or precision robotics for wafer-level or die-level processes.

Hands-on experience integrating motion controllers, vision systems and dispensing/jetting subsystems.

Familiarity with semiconductor manufacturing standards and data protocols.

Experience in collaborative system development with third-party automation vendors, research partners, or OEM customers.