Senior/Principal Module Design Engineer

Nexperia; Catania; In loco; EUR 40.000 - 60.000; Tempo pieno

Descrizione del lavoro

A leading semiconductor company in Catania is seeking a skilled Mechanical Designer to focus on the mechanical design and integration of advanced power modules. The role involves collaboration with engineers, the development of CAD models, and ensuring design compatibility with assembly processes. Ideal candidates will have a degree in Mechanical Engineering, 3+ years of experience, and strong proficiency in CAD tools. Offers cutting-edge technology opportunities and career development in a global organization.

Servizi

Career development in a global organization

Opportunity to work on cutting-edge technologies

Strong connection with partners

Competenze

• 3+ years of experience in mechanical design, preferably in power electronics or semiconductor packaging.
• Proficient in CAD and FEA tools.
• Available to travel for 25% of working time.

Mansioni

• Design mechanical structures for power modules and packages.
• Collaborate with process engineers on design compatibility.
• Document design processes and specifications.

Conoscenze

Mechanical design

CAD proficiency

Problem-solving

Thermal management techniques

Formazione

Bachelor’s or Master’s degree in Mechanical Engineering

Strumenti

SolidWorks

ANSYS

FEA tools

Descrizione del lavoro

Overview

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

This is your new job

We are seeking a skilled and detail-oriented Mechanical Designer to join our Power Modules and Power Packages R&D team. The role focuses on the mechanical design and integration of advanced power modules and discrete packages, with a strong emphasis on assembly process compatibility, thermal management, reliability, and manufacturability. The ideal candidate will contribute to the development of next-generation solutions based on SiC and GaN technologies for traction and industrial applications.

Responsibilities

• Design mechanical structures for power modules and packages, including housings, substrates, interconnects, and cooling systems
• Integrate mechanical design with assembly process requirements, including:
• Sintering (Ag or Cu)
• Gel-filling and potting
• Press-fit and soldering
• Wire bonding and clip bonding
• Encapsulation and molding
• Large area soldering / sintering
• Collaborate with process engineers to ensure mechanical designs are compatible with automated and semi-automated assembly lines
• Develop 3D CAD models and detailed drawings using tools such as SolidWorks, Inventor or CATIA
• Perform mechanical simulations (e.g., stress, vibration, thermal expansion) using FEA tools (e.g., ANSYS, COMSOL) is a nice to have
• Support prototyping, testing, and validation of mechanical designs in collaboration with internal labs and external partners
• Contribute to design-for-manufacturing (DFM) and design-for-reliability (DFR) initiatives
• Interface with suppliers and manufacturing teams to ensure feasibility and quality of mechanical components
• Document design processes, specifications, and test results in compliance with internal standards and industry regulations

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering or related field
• 3+ years of experience in mechanical design, preferably in power electronics or semiconductor packaging
• Proficiency in CAD and FEA tools
• Solid understanding of materials used in power electronics (metals, ceramics, polymers) and their mechanical/thermal properties
• Experience with assembly processes relevant to power modules and packages
• Familiarity with thermal management techniques (e.g., heat sinks, TIMs, liquid cooling)
• Knowledge of reliability standards (e.g., JEDEC, IEC) and environmental testing
• Strong problem-solving skills and ability to work in cross-functional teams
• Fluent in English; Chinese would be a plus
• Available to travel for 25% of working time
• Experience with SiC, GaN or IGBT-based power modules
• Background in traction or industrial applications
• Exposure to processes and manufacturing or advanced packaging technologies
• Knowledge of PCB design and integration is a nice to have

What we offer

• Opportunity to work on cutting-edge technologies in a collaborative and innovative environment.
• Strong connection with academic and industrial partners.
• Career development in a global organization with a focus on sustainability and electrification.

DEI and Compliance

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.