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Ephos in Lombardia, Italy seeks an Electronics Engineer to design and implement the electronics systems behind our production tools. You will shape architecture, select sensors/actuators, design PCBs, and develop embedded firmware in C/C++, collaborating with process and manufacturing teams.
Initially hands-on from schematic to bench, the role expands to electronics for our advanced packaging demonstrators, linking control loops with mechanical integration. Full-time lab presence is required.
Ephos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have already delivered products to leading global firms, and we are currently building a new fabrication facility to scale production by 100x. This expansion is backed by a $50M EU CHIPS Act grant—the first ever awarded to a startup.
The Electronics Engineer will design the electronics systems that control our production tools: architecture, PCBs, embedded firmware and control loops. That means helping in selecting the sensors and actuators the machines need, designing the electronics around them, and tying everything to a central controller. The work is hands-on, from schematic to a board on the bench, in close contact with the process and manufacturing teams. As the role grows, it extends to the electronics behind our advanced packaging demonstrators, where the same skills go into making a full optical link measurable.