Advanced Packaging Engineer

JR Italy; Roma; In loco; EUR 50.000 - 70.000; Tempo pieno

Descrizione del lavoro

An innovative start-up in Italy is seeking an Advanced Packaging Engineer to lead device packaging projects and develop 2.5/3D advanced packaging solutions. The role involves collaborating with OSATs and managing the internal packaging team. Remote work is available for this position. Candidates should have strong semiconductor packaging experience and excellent team management skills.

Competenze

• Strong background in semiconductor packaging.
• Proven ability in 2.5/3D advanced packaging solutions.
• Effective communication and management skills.

Mansioni

• Lead device packaging projects and roadmaps.
• Collaborate with OSATs during the entire project lifecycle.
• Manage the internal packaging team and drive package development.

Conoscenze

Strong semiconductor packaging experience

Expertise in 2.5/3D advanced packaging solutions

Excellent communication skills

Team management abilities

Experience liaising with OSATs

Degree qualification

Descrizione del lavoro

Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.

The role involves developing 2.5/3D advanced packaging solutions and collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities.

This position can be worked remotely.

Required skills:

1. Strong semiconductor packaging experience and knowledge
2. Expertise in 2.5/3D advanced packaging solutions
3. Excellent communication skills and team management abilities
4. Experience liaising with OSATs
5. Degree qualification

Please contact Rachel Anderson for further details.