Attiva gli avvisi di lavoro via e-mail!
A cutting-edge start-up in Naples is seeking an Advanced Packaging Engineer to lead device packaging projects and develop 2.5/3D advanced packaging solutions. This role involves collaborating with OSATs and managing the internal packaging team. Candidates should have strong semiconductor packaging knowledge and excellent communication skills. The position is remote-friendly.
Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps.
The role involves developing 2.5/3D advanced packaging solutions and collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities.
This position can be worked remotely.
Please contact Rachel Anderson for further details.