Training Technician

Tata Electronics; Mayang; On-site; INR 350,000 - 520,000; Full time

Job summary

Tata Electronics Private Limited invites applications for a training specialist to deliver practical and theoretical instruction in IC manufacturing, including wafer handling, die attach, wire bonding, and testing.

You will teach cleanroom protocols, ESD control, safety practices, and guide entry-level candidates through OSAT-aligned curricula with hands-on labs and demonstrations.

Qualifications

• 1–5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing.
• Experience in cleanroom or ESD-controlled environments is highly desirable.
• Training or mentoring experience is an added advantage.
• Strong communication and demonstration skills.

Responsibilities

• Deliver practical and theoretical training on IC manufacturing processes such as wafer handling, die attach, wire bonding, encapsulation, trimming and testing.
• Instruct trainees on cleanroom protocols, ESD control, contamination control and safety practices.
• Demonstrate process flow from wafer to finished IC package and explain yield, defects and failure modes.
• Prepare trainees for OSAT and NSQF-aligned skill assessments through mock tests and evaluations.
• Maintain training equipment, calibration readiness and training documentation.
• Coordinate with industry partners and placement teams when required.

Skills

Clear communication

Training/mentoring

Patience

Discipline & safety

Education

ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology

OSAT / NSQF / Semiconductor Skill Certification

Job description

About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

About The Business

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence. Tata Electronics is a subsidiary of the Tata group.

The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Key Responsibilities

• Deliver practical and theoretical training on IC manufacturing processes such as:
• Wafer handling and preparation
• Die attach, wire bonding, and flip-chip processes
• Encapsulation / molding techniques
• Trimming, forming, and singulation
• Electrical testing, burn-in, and final test
• Train students on semiconductor equipment operation, tool handling, and basic machine troubleshooting.
• Instruct trainees on cleanroom protocols, ESD control, contamination control, and safety practices.
• Demonstrate process flow from wafer to finished IC package and explain yield, defects, and failure modes.
• Conduct hands-on labs, simulations, and process demonstrations as per OSAT curriculum.
• Prepare trainees for OSAT / NSQF-aligned skill assessments through mock tests and skill evaluations.
• Ensure compliance with quality systems such as SPC, SOPs, and basic ISO practices relevant to IC manufacturing.
• Maintain training equipment, ESD stations, and consumables; ensure calibration and readiness.
• Track trainee performance, attendance, and competency development; maintain training documentation.
• Support internal and external assessors during OSAT certification assessments.
• Provide basic orientation on semiconductor industry expectations, shift culture, and shop-floor discipline.
• Coordinate with industry partners, assessment bodies, and placement teams when required.

Required Qualifications

• ITI / Diploma in Electronics, Electrical, Mechatronics, Instrumentation, or Semiconductor Technology.
• OSAT / NSQF / Semiconductor Skill Certification preferred.

Experience

• 1–5 years of hands-on experience in IC manufacturing, semiconductor assembly & test, or electronics manufacturing.
• Experience in cleanroom or ESD-controlled environments is highly desirable.
• Training or mentoring experience is an added advantage.

Technical Skills

• Knowledge of semiconductor assembly and test processes.
• Understanding of IC packaging types (DIP, QFN, BGA, CSP, etc.).
• Familiarity with ESD standards, cleanroom protocols, and contamination control.
• Basic understanding of yield, defects, and failure analysis.
• Ability to read process flow diagrams, SOPs, and equipment manuals.
• Basic computer skills for reporting and documentation.

Soft Skills

• Clear communication and demonstration skills.
• Strong discipline and safety-first mindset.
• Patience and ability to train entry-level candidates.
• Willingness to upgrade skills with evolving semiconductor technologies.

Work Environment

• Training labs simulating cleanroom and IC manufacturing environments.
• May require extended hours during assessments or industry-aligned programs.

Key Performance Indicators (KPIs)

• Trainee competency and OSAT assessment success rate.
• Compliance with cleanroom, ESD, and safety standards.
• Equipment uptime and lab readiness.
• Trainee feedback and placement readiness in semiconductor roles.