Test Product Hardware Engineer

Tata Electronics (TEPL); Assam; On-site; INR 1,500,000 - 2,300,000; Full time

Job summary

Tata Electronics (TEPL) seeks an experienced semiconductor test engineer to lead production testing at wafer and package levels. You will develop and update test programs, LB and probe cards, and work closely with ECNs to optimize test efficiency.

The role requires expertise with Teradyne/Advantest ATE systems and cross-functional collaboration across test and engineering teams. You will debug devices, perform characterization across temperatures, and help craft robust test procedures for

Qualifications

• 10+ years in semiconductor testing in ATE environments.
• Experience in OSAT or IDM wafer and final test.
• Strong in updating test programs/ LB/ probe cards with ECN changes.
• Experience with Teradyne/Advantest platforms and ATE hardware knowledge.

Responsibilities

• Responsible for product testing at wafer and package level for various devices.
• Offload test from customer and run production test.
• Build new test hardware and improve test cost and time.
• Develop test programs for Digital, Mixed signal, RF devices in ATE environments.
• Debug devices using ATE tools and verify with bench tests.
• Collaborate with teams to understand datasheets and craft detailed test procedures.
• Work with multiple teams for device characterization and temperature testing.
• Knowledge on data extraction tools like Perl/Python is advantageous.

Skills

ATE testing

C/C++

Python

Perl

VB

Digital test

RF test

Education

B.E./B.Tech in Electronics or Electrical Engineering

Tools

Teradyne ETS/364/88/800

UltraFlex

J750

Magnum

Advantest V93K

PCB design tools

Job description

Responsibilities

• Responsible for Product testing at Wafer and Package level for different type of devices.
• Off load the test from the customer and run production test.
• Strong in Updating the test program/LB/Probe card based on the ECN changes.
• Expert with OSAT process for Product test.
• Yield optimization, lot Deposition with Customer and Fab.
• Single site to Multisite conversions.
• Test Cost reduction, Test time optimization.
• Build a dditional test HW.
• Sound knowledge on Digital, Mixed signal, RF test methodologies. Experience in developing the test programs in ATE environment for Digital, mixed signal, RF devices.
• Device debug for Digital, Mixed Signal, RF devices using ATE tools and verify with bench Test results.
• Responsible for working with different teams for understanding the device datasheet and come up with a detailed Test procedure/plan to test the chip in ATE environment.
• Strong working experience in Teradyne test systems like ETS(364/88/800), UltraFlex, J750, Magnum, Advantest V93K systems or any other ATE Tester.
• Knowledge on ATE hardware design (load board probe card), PCB design tools and Signal Integrity analysis.
• Knowledge on Device Characterization, testing at different temperatures.
• Knowledge on data extraction tool like Perl, Python will be added advantage.

Essential Attributes

• Good Knowledge on ATE working on all the tester platforms ( Teradyne , Advantest , Cohu ) , C/C++, VB, Python, Perl.
• Ability in Customer communication and interaction provide status update through e-mails and conference calls.
• Able to initiate and execute projects independently and should be a team player.

Education Qualification

Degree in Engineering ( ECE/EEE) .

Required Experience

• Candidate should have minimum 10 years' experience in semi-conductor testing in ATE.
• Work experience in OSAT or IDM on the wafer test and Final test products.