Product & Test Engineer (Probe & Final Test)

Kaynes Semicon; Ahmedabad; On-site; INR 89,280 - 167,400; Full time

Job summary

Kaynes Semicon in Ahmedabad is looking for an experienced Product & Test Engineer to support semiconductor product development. The role involves working with cross-functional teams, improving yield, and ensuring test program development. A B.E./B.Tech or M.E./M.Tech in Electronics or related fields is required, along with solid experience in ATE automation and strong analytical skills. Ideal candidates will have proven industry experience and a good understanding of integrated circuits.

Qualifications

• 2+ years of experience in semiconductor ATE Product & Test Engineering.
• Hands-on expertise with major ATE platforms.
• Solid knowledge of integrated circuits.

Responsibilities

• Work with cross-functional teams on NPI development.
• Support development of ATE test hardware requirements.
• Drive Cost Reduction: Test Time Reduction and Yield Improvement.
• Perform yield enhancement and ATE data collection.

Skills

Programming and scripting skills (Python, C/C++, TCL, Perl)

Data analysis

Strong analytical capabilities

Team player with leadership skills

Education

B.E./B.Tech or M.E./M.Tech in Electronics, Electrical, Computer Engineering

Tools

Teradyne UltraFlex

J750

Advantest V93K

National Instruments (NI)

CoHu

Aemulus

AccoTest

JMP software

Minitab software

Job description

Vacancies Availability

14 positions

Company Description

Kaynes Semicon is located in GIDC, Sanand, Ahmedabad, India. Kaynes Semicon builds advanced semiconductor assembly, packaging, test, and reliability capability to enable silicon technologies to scale into industrial manufacturing. Our Vision is to be the global benchmark in semiconductor manufacturing, transforming advanced silicon into scalable, high-reliability solutions.

Job Summary

We are seeking an experienced Product & Test Engineer to support end to end semiconductor product development, including silicon bring up, test program development, characterization, yield improvement and high volume manufacturing (HVM) support in OSAT (Outsourced Semiconductor Assembly and Test) environment.

Responsibilities

• Work with cross‑functional teams on new product introduction/development through the entire NPI development cycle (Concept, definition, execution, product launch/ramp) or new product transfer from customer site for capacity expansion.
• Translates product specification and system requirements into test requirements and coverage methods.
• Support development of ATE test hardware requirements and review schematics and plots for probe card and device interface board.
• Drive Cost Reduction: Test Time Reduction, flow reduction and Yield Improvement.
• Perform yield enhancement by identifying fail modes, quantity of material affected, fallout rate, etc.
• Characterization (CZ) activities – Defining matrix lots, generating CZ flow, ATE CZ data collection, performing bench measurements, micro probing, thermal evaluation, data analysis, presenting and generating reports.
• Perform ATE data collection and failure characterization to determine the failure mechanism(s).
• Collaborate with Assembly, Quality & Reliability team and customer to qualify new package, BOM supplier or die revision.
• Assist with Customer Quality Incident investigations (ATE test, lab analysis and failure analysis support)
• Generate technical documentation such as statistical analysis report, evaluation summary report, lessons learned.
• Assist in correlating critical ATE parametric measurements correlate with lab measurements.
• Help drive new innovative solutions and methodologies to improve cycle time and cost.
• Own and manage PE deliverables working with cross functional teams.

Job Qualifications

• B.E./B.Tech or M.E./M.Tech in Electronics, Electrical, Computer Engineering or relevant disciplines.
• Proven industry experience in semiconductor ATE Product & Test Engineering for Probe and/or Final Test with min experience of 2 years.
• Strong programming and scripting skills, including Python, C/C++, TCL, or Perl for ATE automation and data processing.
• Hands‑on expertise with major ATE platforms, such as: Teradyne UltraFlex, J750, Advantest V93K, National Instruments (NI), CoHu, Aemulus and AccoTest.
• Experience in TTR activities and PVT (Process/Voltage/Temperature) characterization on corner testing.
• Solid knowledge of integrated circuits in CMOS, BJT, IGBT, Power IC Devices, IPMs.
• Basic skills in statistics and familiarity with JMP software/Minitab software is a plus.
• Strong analytical capabilities in data analysis, statistical decision making and problem‑solving.
• Strong written and verbal communication skills.
• Self‑motivated. Able to plan, execute and deliver within given timeline.
• Strong team player with leadership, negotiation, and collaboration skills.
• Experience working with OSATs, including NPI, correlation, production qualification and Mass production is a plus.
• Hands‑on with Handlers and Probers is a plus.
• Good Understanding in test hardware, including load boards, probe cards, and socket.