Technical Lead, Signal Integrity

Molex; Bengaluru; On-site; INR 3,500,000 - 6,500,000; Full time

Job summary

Molex seeks an SI Interconnect Engineer in Bengaluru to work at the intersection of mechanical design and electrical performance. You will develop high-speed interconnects for automotive and data center applications using 3D EM simulations and high-frequency lab equipment.

You will model connectors with HFSS or CST, run virtual prototypes, and validate via VNA/TDR measurements up to 20 GHz, ensuring signal integrity while collaborating with mechanical teams.

Qualifications

• BE/B.Tech in Electronics/Electrical Engineering or pursuing MS/PhD with EM focus.
• 7–10 years experience in Signal Integrity using HFSS or CST.
• Ability to translate complex EM concepts into actionable design advice for mechanical teams.

Responsibilities

• 3D EM Simulation & Modeling using HFSS or CST to create high-fidelity 3D models.
• Lab Validation & Characterization with VNA/TDR up to 20 GHz.
• Crosstalk Simulation & Discovery including NEXT/FEXT modeling and ICN calculations.
• Crosstalk Validation (Lab/Post-Layout) with multi-port measurements.
• Data Analysis & Automation using Python/MATLAB for large datasets.
• Documentation & Collaboration with Mechanical Engineers on design impact.

Skills

Signal Integrity

3D EM Simulation

HFSS

CST Studio Suite

ADS

Cadence Sigrity

Python

MATLAB

Oscilloscopes

Education

BE/B.Tech Electronics/Electrical Engineering

MS/PhD in Electrical Engineering or Physics (EM focus)

Tools

Ansys HFSS

CST Studio Suite

ADS

Cadence Sigrity

Python

MATLAB

Oscilloscopes

VNAs

Job description

Your Job

As an SI Interconnect Engineer, you will work at the intersection of mechanical design and electrical performance. You will support the development of next-generation interconnect solutions (such as USB-C, HFM, and HS-Max) by using advanced 3D electromagnetic (EM) simulation tools and high-frequency lab equipment. Your goal is to ensure that Molex products maintain signal integrity across demanding automotive and data center environments.

Your Job

As an SI Interconnect Engineer, you will work at the intersection of mechanical design and electrical performance. You will support the development of next-generation interconnect solutions (such as USB-C, HFM, and HS-Max) by using advanced 3D electromagnetic (EM) simulation tools and high-frequency lab equipment. Your goal is to ensure that Molex products maintain signal integrity across demanding automotive and data center environments.

Our Team

Molex CMS Networking team is a leader in Interconnect in providing connectivity solutions in Automotive industry in the area of high speed. In this role, you aren't just placing components; you are designing the components that make modern technology possible. You will gain exposure to:

• Automotive high-speed links (Self-driving car data backbones).
• Automotive Ethernet, Ser, Deser and other systems
• Complex Material Science (How different plastics and plating affect signals).

What You Will Do

3D EM Simulation & Modeling

• Full-Wave Modeling: Assist in creating high-fidelity 3D models of connectors and cable terminations using Ansys HFSS or CST Studio Suite.
• Virtual Prototyping: Run simulations to extract S-parameters and identify impedance discontinuities within the connector pin-field and mating interface.
• Optimization: Perform "what-if" analyses on mechanical variables (e.g., pin geometry, plastic dielectric constants, shield spacing) to optimize return loss and crosstalk.

Lab Validation & Characterization

• High-Frequency Measurement: Use Vector Network Analyzers (VNA) and Time Domain Reflectometers (TDR) to characterize physical prototypes up to 20 GHz or higher.
• Fixture De-embedding: Learn and apply de-embedding techniques (like AFR or TRL) to remove the effects of test boards, isolating the performance of the connector itself.
• Correlation: Compare lab measurement data against simulation models to validate accuracy and refine simulation methodologies.

Crosstalk Simulation & Discovery (Pre-Silicon/Pre-Layout)

• Aggressor-Victim Analysis: Use Ansys HFSS to perform "discovery" simulations identifying the most significant crosstalk contributors within a high-density pin array.
• NEXT/FEXT Modeling: Extract Near-End Crosstalk (NEXT) and Far-End Crosstalk (FEXT) S-parameters to determine the isolation levels between differential pairs.
• ICN Calculation: Calculate Integrated Crosstalk Noise (ICN) and Power Sum Crosstalk to evaluate total noise interference against IEEE 802.3 or OIF-CEI limit lines.
• Pin-Map Optimization: Based on crosstalk discovery, provide recommendations for optimized signal-to-ground ratios and pin-mapping (e.g., G-S-S-G patterns) to shield sensitive high-speed lines.

Crosstalk Validation (Lab/Post-Layout)

• Multi-Port Measurements: Utilize 4-port or 8-port Vector Network Analyzers (VNAs) to measure real-world crosstalk in physical prototypes and connector mating interfaces.
• Time Domain Analysis: Use TDR/TDT to locate the exact physical location of a crosstalk "hotspot" within a connector body or cable transition.
• Correlation: Document discrepancies between simulated crosstalk and measured crosstalk, investigating factors such as manufacturing tolerances in pin-to-pin spacing or plating consistency.

Data Analysis & Automation

• Scripting: Utilize Python or MATLAB to automate the processing of large Touchstone sNp file datasets.
• Compliance Testing: Analyze simulation and test results against industry standards such as IEEE 802.3 (Ethernet), USB4, or USCAR-2 specifications.

Documentation & Collaboration

• Technical Reports: Prepare professional SI reports summarizing performance vs. specifications for internal design reviews.
• Cross-Functional Support: Interface with Mechanical Engineers to explain how physical design changes impact electrical performance.

Who You Are (Basic Qualifications)

• B.E/B.Tech in Electronics/Electrical Engineering, or pursuing a M.S., or Ph.D. in Electrical Engineering or Physics with coursework focused in Electromagnetics, Microwave Engineering, or Circuit Theory.
• 7-10 Years experience in Signal Integrity using Ansys HFSS or CST.
• Strong desire to understand the "why" behind signal degradation.
• Ability to translate complex EM concepts into actionable design advice for mechanical teams.

What Will Put You Ahead

• Understanding of transmission line theory, characteristic impedance and S-parameters.
• Exposure to Ansys HFSS, ADS, or Cadence Sigrity.
• Basic proficiency in programming such as Python (NumPy, Pandas, Matplotlib) or MATLAB.
• Basic experience with oscilloscopes or VNAs is a significant plus.

At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy.

Who We Are

At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company. Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.