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Koch in Bengaluru, India seeks a Tech Lead for Thermal & High-Power Systems to guide a multidisciplinary simulation team addressing data center, high-power connectivity, liquid cooling, automotive, and industrial applications. You will drive CFD and thermal programs, mentor engineers, and help advance Virtual Product Qualification through simulation-led development.
You will establish standards, validate models against data, and partner with product and design teams to identify thermal risks
As a Tech Lead for Thermal & High-Power Systems , you will provide hands-on technical leadership to a multidisciplinary simulation team solving complex thermal challenges across data center, high-power connectivity, liquid cooling, automotive, and industrial applications.
You will combine deep expertise in thermal engineering and CFD with the ability to guide engineers, establish simulation standards, review complex models, and coordinate critical technical programs. You will play an important role in advancing Virtual Product Qualification by enabling simulation-led product development, reducing dependence on physical prototypes, and improving the speed and confidence of engineering decisions.
The Global Engineering Services Multiphysics Simulation Group supports Molex businesses worldwide through predictive engineering, simulation, and Virtual Product Qualification. The team works across thermal and CFD, structural mechanics, signal integrity, electromagnetic compatibility, and multiphysics domains, with a strong focus on data center and high-power applications.
Provide technical leadership for complex thermal and CFD simulation programs involving liquid-cooled cold plates, manifolds, microchannels, heat exchangers, air cooling, immersion cooling, and high-power connector systems.
Lead the technical execution of thermal simulation programs for data center product lines such as OSFP, QSFP, co-packaged optics, power connectors, and backplane systems.
Review simulation methodologies, assumptions, boundary conditions, mesh strategies, material properties, convergence criteria, and results to ensure physics fidelity and engineering credibility.
Guide engineers in conjugate heat transfer, thermal resistance modeling, pressure-drop analysis, flow-distribution optimization, junction-temperature prediction, and thermal interface material characterization.
Serve as a technical mentor to simulation engineers by strengthening their problem-solving capabilities, engineering judgment, and understanding of thermal and fluid physics.
Coordinate the technical work of a multidisciplinary simulation team, establish work priorities, remove technical roadblocks, and promote effective collaboration across thermal, structural, SI, and EMC disciplines.
Establish and continuously improve standards, templates, quality gates, and best practices for thermal and high-power simulation deliverables.
Drive validation and correlation of CFD and thermal models against physical test data, while clearly communicating prediction confidence, model limitations, and areas of uncertainty.
Partner with product, systems, design, and test engineering teams to define simulation requirements and identify thermal risks early in the product development lifecycle.
Investigate emerging thermal-management technologies, including direct liquid cooling, two-phase cooling, phase-change materials, and advanced cold-plate architectures, and assess their relevance to Molex products.
Communicate complex thermal findings to technical and non-technical stakeholders through clear recommendations, design insights, and business-relevant outcomes.
Demonstrate the value of simulation through prototype reduction, thermal-risk mitigation, qualification-cycle compression, design optimization, and NPI cost reduction.
Promote a team culture grounded in scientific integrity, technical curiosity, constructive challenge, knowledge sharing, and continuous learning from simulation and validation results.
Master’s or PhD in Mechanical Engineering, Thermal Sciences, Heat Transfer, Fluid Mechanics, or a closely related engineering discipline, with substantial academic or professional work in thermal or fluid dynamics.
Ten or more years of engineering experience in thermal analysis, CFD, heat transfer, or multiphysics simulation, including experience providing technical leadership, project leadership, or mentorship to engineers.
Hands-on experience using thermal and CFD tools such as Ansys Fluent, Ansys CFX, Simcenter STAR-CCM+, or an equivalent commercial simulation platform.
Experience with high-power electronic systems involving liquid cooling, cold plates, heat exchangers, thermal interface materials, conjugate heat transfer, electronics cooling, or data center cooling architectures.
Experience with data center products or technologies such as OSFP, QSFP, co-packaged optics, high-density connectors, power distribution modules, servers, racks, or system-level thermal management.
Experience with cold-plate design, microchannel flow, pressure-drop optimization, flow-uniformity analysis, or two-phase thermal-management technologies.
Experience developing reduced-order thermal models, Digital Twins, surrogate models, Physics-Informed Neural Networks, or AI/ML-based thermal prediction methods.
Experience correlating simulation results with laboratory testing and defining confidence levels or uncertainty bounds for thermal predictions.
Demonstrated ability to mentor engineers, facilitate technical reviews, build reusable engineering knowledge, and improve simulation practices across teams.
Familiarity with Koch’s Principle-Based Management philosophy or an equivalent principled operating framework.
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At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company.
Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results.