Staff Physical Design Engineer

TylSemi; Bengaluru; On-site; INR 1,500,000 - 2,000,000; Full time

Job summary

TylSemi is looking for a highly skilled Staff Physical Design Engineer in Bengaluru, India, to lead physical implementation for advanced semiconductor designs. The ideal candidate will drive implementation activities and collaborate across teams to ensure high-quality tape-outs focused on power, performance, and area.

The position demands deep expertise in physical design methodologies and the ability to mentor junior engineers, making a significant impact on the project's success.

Qualifications

• 8+ years of hands-on experience in ASIC/SOC physical design implementation.
• Solid understanding of timing closure, low-power design techniques, signal integrity, IR/EM analysis, and physical verification.

Responsibilities

• Lead full-chip or block-level physical design implementation from floorplanning to GDS signoff.
• Drive floorplanning, power planning, placement, CTS, routing, optimization, and physical verification closure.
• Support tape-out activities and ensure design signoff quality across all implementation stages.

Skills

Leadership in physical design implementation

Collaboration with RTL, STA, DFT, and CAD teams

Debugging complex issues

Mentoring junior engineers

Strong scripting skills in Tcl, Perl, or Python

Expertise in EDA tools like Cadence Innovus and Synopsys ICC2

Education

Bachelor's or Master’s degree in Electronics, Electrical Engineering, VLSI

Tools

Cadence Innovus

Synopsys ICC2

PrimeTime

StarRC

Job description

We are looking for a highly skilled Staff Physical Design Engineer to drive end-to-end physical implementation for advanced semiconductor designs across cutting‑edge technology nodes. The ideal candidate will lead block/subsystem‑level implementation activities, collaborate cross‑functionally with RTL, STA, DFT, and CAD teams, and ensure high‑quality tape‑outs with a strong focus on power, performance, and area (PPA). This role requires deep expertise in physical design methodologies, debugging complex issues, and mentoring junior engineers.

What You’ll Do

• Lead full‑chip or block‑level physical design implementation from floorplanning to GDS signoff.
• Drive floorplanning, power planning, placement, CTS, routing, optimization, and physical verification closure.
• Analyze and optimize timing, congestion, IR drop, EM, and power for advanced technology nodes.
• Collaborate with RTL, DFT, STA, package, and CAD teams to resolve implementation and signoff challenges.
• Develop and improve physical design flows, automation scripts, and methodology enhancements.
• Support tape‑out activities and ensure design signoff quality across all implementation stages.
• Mentor junior engineers and contribute to technical reviews and best practices.

What We’re Looking For

• Bachelor’s or Master’s degree in Electronics, Electrical Engineering, VLSI, or related field.
• 8+ years of hands‑on experience in ASIC/SOC physical design implementation.
• Strong expertise in industry‑standard EDA tools such as Cadence Innovus, Synopsys ICC2, PrimeTime, and StarRC.
• Solid understanding of timing closure, low‑power design techniques, signal integrity, IR/EM analysis, and physical verification.
• Experience working on advanced technology nodes (7nm/5nm/3nm preferred).
• Strong scripting skills in Tcl, Perl, or Python for automation and flow enhancement.
• Excellent debugging, problem‑solving, communication, and stakeholder collaboration skills.

Good to Have

• Experience with hierarchical and top‑level SOC integration.
• Exposure to ML/AI‑based design optimization methodologies.
• Knowledge of package‑aware implementation and multi‑die/chiplet architectures.

Success in This Role Looks Like

• Consistent delivery of high‑quality physical design milestones with minimal schedule impact.
• Successful closure of timing, power, area, and reliability metrics for complex SOC designs.
• Proactive identification and resolution of implementation bottlenecks and signoff risks.
• Positive contribution to team productivity, methodology improvements, and mentoring initiatives.