Silicon Packaging Design Engineer

Intel Corporation; Bengaluru; On-site; INR 3,500,000 - 6,000,000; Full time

Job summary

Intel Corporation in Bengaluru seeks an experienced IC Packaging Design professional to define and optimize packaging schemes for advanced ICs. You will co-design with chip designers and PCB teams to optimize pad layouts and pin maps for cost efficiency, while leading lead frame and substrate development with simulations to minimize cross-talk and IR drop.

The role involves close collaboration with assembly sites to ensure compliance with rules, readiness for NPI, and maintaining precise

Qualifications

• Bachelor / Master degree in Electrical Engineering / Mechanical Engineering / Material Science with more than 10 years experience in the field of IC Packaging Design and Layout.
• Package design experience using Siemens Xpedition EDA tool set is a must.
• Understand performance and cost trade-offs for different layout and assembly rules.
• Extensive manufacturing process knowledge regarding wafer bumping, substrate and lead frame manufacturing and assembly of wire bond and flip chip packages is required.
• Practical knowledge of Signal integrity and Power integrity in PCB design will be an advantage.
• Possesses good analytical, communication and organization skills.

Responsibilities

• Define packaging solutions for highly innovative ICs, achieving lowest package and system-level cost.
• Co-design with chip designer, system engineering and PCB design teams to optimize pad layout and pin map.
• Plan, design and develop lead frame/substrate/module with electrical simulation to reduce cross-talk, IR drop and noise.
• Provide technical lead for implementing packaging solutions at OSAT or internal assembly sites.
• Ensure optimized package design meeting assembly site rules and specs.
• Coordinate with NPI manager to prepare assembly site readiness and maintain uninterrupted flow from wafer fab-out to tested samples.
• Maintain complete set of product-specific packaging drawings and reports.

Skills

Analytical skills

Communication skills

Organizational skills

Signal integrity

Power integrity

Education

Electrical/Mechanical/Materials engineering degree

Tools

Siemens Xpedition EDA

Job description

Job Details: Job Description

Define packaging solutions for highly innovative integrated circuits, meeting adequate mechanical, thermal and electrical performance with the goal to achieve lowest package and system level cost. Co-design with chip designer, system engineering and PCB design teams during the development stage to optimize pad layout and pin map for most cost effective package and system. Independently plan, design and develop quality custom lead frame/substrate/module with supporting electrical simulation to reduce cross-talk, IR drop, and noise issues of the device. Technical lead for implementing packaging solutions at OSAT assembly site and/or internal assembly site. Ensure optimized package design which meets the assembly design rules of the selected assembly site. Work with the assembly partner to mitigate any potential risk and improve situation to meet yield target within the project milestone requirement. Co-work with NPI manager to prepare assembly site readiness for continuous uninterrupted flow from wafer fab-out to quality packaged sample meeting the required NPI schedule. Maintain complete set of product specific packaging related drawings, and reports.

Qualifications

• Bachelor / Master degree in Electrical Engineering / Mechanical Engineering / Material Science with more than 10 years experience in the field of IC Packaging Design and Layout.
• Package design experience using Siemens Xpedition EDA tool set is a must.
• Understand performance and cost trade-offs for different layout and assembly rules.
• Extensive manufacturing process knowledge regarding wafer bumping, substrate and lead frame manufacturing and assembly of wire bond and flip chip packages is required.
• Practical knowledge of Signal integrity and Power integrity in PCB design will be an advantage.
• Possesses good analytical, communication and organization skills.

Job Type and Location

Job Type: Intel Contract Employee Shift: Shift 1 (India) Primary Location: India, Bangalore Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence.

Additional Information

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.