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Microchip Technology Inc. in Hyderabad is seeking a motivated Signal Integrity and Power Integrity Engineer with 3–6 years of experience to support high-speed package and PCB design.
The role focuses on SI/PI analysis, modeling, and simulation to ensure robust high-speed performance and reliable power delivery across products. You'll collaborate with system-hardware and packaging teams, analyze S-parameters and PDN frequency responses, and apply Cadence Sigrity, ADS, Ansys SIwave/HFSS, and
Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.
Looking for a motivated Signal Integrity and Power Integrity Engineer with 3–6 years of experience to support high-speed package and PCB design. The candidate will have a strong foundation in SI/PI analysis, modeling, and simulation, along with exposure to package and PCB design. Candidate will work closely with system-hardware and packaging teams to ensure robust high-speed performance and reliable power delivery across products.
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