Tech Staff, Signal Integrity Engineer

Microchip Technology Inc.; Chennai District; On-site; INR 2,500,000 - 4,000,000; Full time

Job summary

Microchip Technology Inc. is seeking a senior engineer to lead signal integrity and package design efforts for high-speed data center and optical applications.

You will work with colleagues across PCB, mixed-signal, and product teams to ensure robust SI performance and reliable packaging. The role requires a bachelor’s in electronics engineering and 12+ years of SI experience, with strong hands-on skills in HFSS/CST MWS/SIWave, ADS/Spectre/Hspice, and Cadence environments.

Qualifications

• Bachelor degree in Electronics Engineering (minimum).
• 12+ years experience in signal integrity design or equivalent.
• Experience with field solvers such as HFSS, CST MWS, SIWave.
• Experience with circuit simulators like ADS, Spectre, Hspice.
• Solid understanding of EMI and transmission line theory; I/O design.
• Familiarity with PCB layout and electrical package design techniques.

Responsibilities

• Oversee all aspects of signal and power integrity for device package designs.
• Collaborate with PCB, mixed-signal, product development and package designers to understand SI requirements.
• Develop packaging that meets electrical design specifications.
• Help evolve SI flows and processes.
• Support customers with SI simulations of complex channels and power systems.
• Produce SI models for internal and external use.
• Review PCB and package designs.

Skills

Signal integrity

PCB layout knowledge

Python scripting

lab measurement equipment

MATLAB

Cadence design environment

Communication skills

Education

Bachelor degree in Electronics Engineering

Tools

HFSS

CST MWS

SIWave

ADS

Spectre

Hspice

IBIS/IBIS-AMI

MATLAB

Cadence Design Environment

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description

The Mixed Signal Development Group is responsible for delivering analog and Mixed-Signal IP to divisions within Microchip. We work with leading edge CMOS processes to produce analog integrated circuits for wireline applications. From T1/E1 to 224Gb/s SERDES, we enable technology that allows Microchip’s products to interface to the outside world.

As a member of the Mixed-Signal Development Group, the candidate will be supervised by a team leader/manager and be engaged in the package designs of highly complex and cutting-edge data center and optical communication processors.

Responsibilities

• Oversee all aspects of Signal and Power integrity for device package designs.
• Collaborate with PCB, Mixed Signal, Product development and package designers to understand SI requirements for devices and package designs.
• Work with package designers to create packaging that meets electrical design specifications.
• Help develop and evolve SI flows and processes
• Support internal and external customers with signal integrity simulations of complex channels and power systems
• Produce signal integrity models for usage by internal and external customers.
• Analysis and design of PCB and Package power systems
• Model future, yet to be designed, systems for the purposes of feasibility
• Review PCB and Package designs

Requirements/Qualifications

• Bachelor degree in Electronics Engineering minimum.
• 12 years or more experience in signal integrity design or equivalent
• Experience and knowledge of field solvers, such as HFSS, CST MWS, SIWave.
• Experience and knowledge of circuit simulators like ADS, Spectre, Hspice.
• Solid understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single ended interface technology
• Experienced and knowledgeable of Printed Circuit Board (PCB) layout or electrical package design techniques
• Familiarity and fundamental understanding of lab measurement equipment. Oscilloscopes, TDR, Vector Network Analyzer, etc.
• Understanding of IBIS and IBIS-AMI
• Experience with MATLAB is an asset.
• Scripting languages such as PERL, Python, and SKILL are an asset
• Innovative and creative thinker
• Experience with Cadence Design Environment an asset
• Strong written and oral communication skills

Travel Time

0% - 25%