Senior / Lead Physical Design Engineer

Axiado Corporation; Hyderabad; On-site; INR 4,000,000 - 7,000,000; Full time

Job summary

Axiado Corporation is seeking a highly experienced Senior / Lead Physical Design Engineer to drive backend implementation, signoff quality, and project execution across our ASIC programs.

This role blends technical leadership with hands‑on execution. You will define implementation strategies, establish Physical Design and Verification flows, review contractor work, and ensure RTL handoff through tapeout while proactively identifying risks and driving scalable, efficient solutions.

Qualifications

• BS/MS in Electrical Engineering or related field.
• 8–12 years of ASIC Physical Design experience.
• Multiple successful tapeouts in advanced technology nodes.
• Strong experience owning implementation from RTL handoff through GDS signoff.

Responsibilities

• Lead Physical Design activities from project planning through tapeout.
• Define implementation strategies, milestones, and execution plans.
• Work closely with contractors, consultants, and external implementation partners to ensure high‑quality deliverables.
• Review implementation progress, identify risks, and drive corrective actions.
• Provide technical leadership across Physical Design, STA, DFT, RTL, and CAD teams.
• Drive design reviews and implementation readiness reviews.

Skills

Technical leadership

Project execution

Cross-functional collaboration

Vendor coordination

Problem solving

Education

BS/MS in Electrical Engineering

Tools

Calibre

IC Validator (ICV)

DRC

LVS

ERC

Antenna

Density Closure

Physical Signoff

Job description

Axiado is building the future of AI powered digital infrastructure. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real‑time platform management. Our technology protects the world’s most critical infrastructure—from data centers to next generation cloud and AI platforms—by securing systems at the foundation levels of hardware, independent of host CPUs and operating systems.

Founded in 2019 and now over 150 employees are strong, Axiado has evolved into a recognized leader in the convergence of AI, security, and silicon innovation. We partner with and are actively engaged in commercial programs with multiple Tier 1 industry leaders, validating both our technology and our long‑term market trajectory. Axiado has also won numerous industry awards for our ground‑breaking products and technological innovations, including being named one of Fast Company’s 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliance’s 2025 “Start‑Up to Watch” award.

At Axiado, developing breakthrough technology takes more than great engineering—it takes a team of exceptional people who collaborate boldly, challenge assumptions, and take pride in building what comes next. We value curiosity, execution, respect, and a shared desire to make a meaningful impact on the security and reliability of the digital world.

Job Description

We are looking for a highly experienced and hands‑on Senior / Lead Physical Design Engineer to drive backend implementation, signoff quality, methodology development, and project execution across our ASIC programs.

This role combines technical leadership with hands‑on execution. The successful candidate will be responsible for defining implementation strategies, establishing Physical Design and Physical Verification methodologies, reviewing and guiding work performed by contractors and external vendors, and ensuring successful execution from RTL handoff through tapeout.

The ideal candidate is a strong shift‑left thinker who can proactively identify implementation risks, influence architectural decisions, and drive scalable solutions while remaining deeply involved in technical problem solving.

Key Responsibilities

Technical Leadership & Project Execution

• Lead Physical Design activities from project planning through tapeout.
• Define implementation strategies, milestones, and execution plans.
• Work closely with contractors, consultants, and external implementation partners to ensure high‑quality deliverables.
• Review implementation progress, identify risks, and drive corrective actions.
• Provide technical leadership across Physical Design, STA, DFT, RTL, and CAD teams.
• Drive design reviews and implementation readiness reviews.

Physical Design Ownership

• Own block and full‑chip implementation activities including:
• Floorplanning
• Power Planning
• Placement
• CTS
• Routing
• Timing Closure
• ECO Implementation
• Signoff Closure
• Drive performance, power, area, congestion, and timing optimization.

Physical Verification & Signoff

• Define and drive signoff methodology and closure strategy.
• Lead DRC, LVS, ERC, Antenna, Density, and Manufacturing rule closure.
• Review and sign off vendor deliverables related to physical verification.
• Debug complex signoff issues and drive root‑cause resolution.

Methodology & Flow Development

• Develop and improve Physical Design methodologies, implementation recipes, and signoff flows.
• Drive automation initiatives to improve productivity and design quality.
• Establish best practices, checklists, and execution guidelines across projects.
• Promote shift‑left methodologies to improve backend predictability and reduce project risk.

Cross‑Functional Collaboration

• Partner with Architecture, RTL, DFT, Verification, Packaging, CAD, and Product teams.
• Influence design decisions through implementation‑aware feedback.
• Drive early risk identification and mitigation planning.
• Support customer, vendor, and management reviews when required.

Qualifications

Required Qualifications

• BS/MS in Electrical Engineering or related field.
• 8–12 years of ASIC Physical Design experience.
• Multiple successful tapeouts in advanced technology nodes.
• Strong experience owning implementation from RTL handoff through GDS signoff.
• Experience leading projects, reviewing deliverables, and coordinating work across multiple stakeholders.

Strong Expertise In

• Floorplanning & Hierarchical Planning
• Power Planning
• Placement & Optimization
• CTS & Clock Architecture
• Routing & Signal Integrity
• STA & Timing Closure
• ECO Methodologies
• MCMM Flows
• Power Optimization
• Low Power Design Techniques

Physical Verification Expertise (Must Have)

• Strong hands‑on experience with:
• Calibre
• IC Validator (ICV)
• Expertise in:
• DRC
• LVS
• ERC
• Antenna
• Density Closure
• Physical Signoff
• Ability to independently debug and resolve complex signoff issues.

Preferred Qualifications

• Experience managing or mentoring junior engineers, contractors, or external vendors.
• Strong Tcl and Python scripting skills.
• Experience developing implementation methodologies and signoff frameworks.
• Experience with advanced nodes (7nm/5nm/3nm and below).
• Familiarity with low‑power implementation and UPF flows.
• Experience with package‑aware floorplanning and bump planning.

Additional Information

All your information will be kept confidential according to EEO guidelines.