Senior Electronics Design Engineer Camera Systems

Dreamvu; Rangareddy; On-site; INR 1,500,000 - 2,100,000; Full time

Job summary

Dreamvu is seeking an experienced hardware design engineer with a deep focus on camera and imaging systems. The role demands hands-on design across high-speed digital and mixed-signal domains, and ownership of multiple hardware products from concept to volume production.

Candidates should have extensive experience with MIPI CSI-2, D-PHY, GMSL/GMSL2 or FPD-Link SerDes, and sensor integration on new boards. Expect a technical interview featuring a live multi-sensor camera problem.

Qualifications

• 712 years of hands-on electronics design experience, including at least 4 years on camera, imaging, or sensor-heavy embedded products.
• Demonstrated end-to-end ownership of at least two hardware products taken from concept to volume production - not a contribution to someone else's board.
• Deep working knowledge of MIPI CSI-2 and D-PHY (lane rates, impedance and skew budgets, virtual channels) and hands-on design with GMSL/GMSL2 or FPD-Link SerDes, including PoC networks and cable channel budgeting.
• Image sensor integration: power sequencing, clocking, analog supply noise, sensor-module flex design, bring-up of a new sensor on a new board.
• Multi-camera hardware synchronization - designed a trigger/FSYNC architecture and measured skew.
• Strong high-speed digital and mixed-signal design: DC-DC and LDO power, power sequencing, clock distribution, SI/PI fundamentals.
• Expert with Altium Designer, Cadence Allegro/OrCAD, or Siemens Xpedition; fluent in the lab with oscilloscope, protocol analyzers, and TDR/VNA.
• Practical EMI/EMC and ESD design experience, having taken a product through certification, with EMS/CM partners through NPI.
• B.E./B.Tech or M.Tech in Electronics, Electronics & Communication, or Electrical Engineering.

Skills

Hands-on electronics design

End-to-end hardware ownership

MIPI CSI-2 / D-PHY knowledge

GMSL/GMSL2 or FPD-Link SerDes

Image sensor integration

Multi-camera synchronization

High-speed digital / mixed-signal

Altium Designer / Cadence / Xpedition

EMI/EMC and ESD design

Education

B.E./B.Tech or M.Tech in Electronics / ECE / Electrical

Tools

Altium Designer

Cadence Allegro/OrCAD

Siemens Xpedition

Oscilloscope

Protocol analyzers

TDR / VNA

Job description

MUST-HAVE QUALIFICATIONS

• 712 years of hands-on electronics design experience, with at least 4 years on camera, imaging, or sensor-heavy embedded products.
• Demonstrated end-to-end ownership of at least two hardware products taken from concept to volume production - not a contribution to someone else's board.
• Deep working knowledge of MIPI CSI-2 and D-PHY (lane rates, impedance and skew budgets, virtual channels) and hands-on design with GMSL/GMSL2 or FPD-Link SerDes, including PoC networks and cable channel budgeting.
• Image sensor integration: power sequencing, clocking, analog supply noise, sensor-module flex design, and bring-up of a new sensor on a new board.
• Multi-camera hardware synchronization - you have designed a trigger/FSYNC architecture and measured the resulting skew, not just enabled a driver flag.
• Strong high-speed digital and mixed-signal design: DC-DC and LDO power, power sequencing, clock distribution, and SI/PI fundamentals.
• Expert with Altium Designer, Cadence Allegro/OrCAD, or Siemens Xpedition; fluent in the lab with oscilloscope, protocol analyzers, and TDR/VNA.
• Practical EMI/EMC and ESD design experience, having personally taken a product through certification, and experience with EMS/CM partners through NPI.
• B.E./B.Tech or M.Tech in Electronics, Electronics & Communication, or Electrical Engineering.

PREFERRED QUALIFICATIONS

• Carrier-board design for NVIDIA Jetson Orin, Qualcomm QCS/Dragonwing, TI TDA4, or NXP i.MX; PoE at 802.3bt Type 3/4 levels; IEEE 1588 / 802.1AS sync at the hardware level.
• Rigid-flex and HDI design (IPC-2223 / IPC-6013, IPC-2226 / IPC-6016, Class 3); microphone array design; IMU integration for visual-inertial systems including calibration fixtures.
• Optical systems literacy - MTF/SFR, active alignment, stray-light control, tolerance analysis - plus SI/PI simulation (Sigrity, SIwave/HFSS, HyperLynx) and scripting (Python, MATLAB).
• Battery qualification (UN 38.3, IEC 62133), AEC-Q or ASIL exposure, or prior work in robotics, autonomous vehicles, drones, or machine vision.

Our interview process is technical: expect to walk through a board you designed and solve a live multi-sensor camera design problem.