Quality and Reliability Manager – Memory Products

Best NanoTech; Ahmedabad District; On-site; INR 4,200,000 - 6,000,000; Full time

Job summary

Best NanoTech in Ahmedabad, Gujarat, India, seeks a senior Quality and Reliability Manager to lead product-quality, package-reliability and qualification activities for memory products in a high-volume semiconductor environment. You will own reliability strategy, qualification execution, product-health monitoring, failure analysis and corrective-action closure for DRAM, NAND and related memory products.

The role requires strong semiconductor quality knowledge and cross-functional collaboration

Qualifications

• Bachelor's or Master's degree in Electronics, Electrical, Materials, Physics, Mechanical, Microelectronics Engineering or related field.
• 12-18 years of semiconductor quality, reliability, package reliability or qualification experience.
• At least 4-6 years of experience managing quality, reliability or failure-analysis engineers.
• Strong experience with semiconductor assembly, packaging and test operations.
• Knowledge of DRAM, NAND, NOR or other memory-product reliability preferred.
• Demonstrated experience planning and executing product and package qualification programs.
• Hands-on knowledge of accelerated reliability testing and failure mechanisms.
• Experience investigating qualification failures, manufacturing excursions and customer complaints.
• Strong understanding of statistical data analysis, quality systems and risk-management methodologies.
• Ability to support global teams and manufacturing escalations in a 24/7 production environment.

Responsibilities

• Lead quality and reliability engineering for semiconductor memory products and package technologies.
• Develop product- and package-qualification strategies aligned with JEDEC and customer requirements.
• Define reliability test plans, qualification matrices, sample sizes, acceptance criteria and release requirements.
• Manage reliability testing, including HTOL, HAST/uHAST, temperature cycling, MSL and high-temperature storage.
• Review qualification results and approve products, packages, materials and process changes for manufacturing release.
• Monitor product-health, reliability, yield, defect and quality indicators during high-volume manufacturing.
• Lead investigation of reliability failures, manufacturing excursions, customer returns and field-quality issues.
• Coordinate electrical and physical failure analysis to identify package-, process-, material- and device-related causes.
• Drive root-cause analysis, containment, corrective action and recurrence-prevention activities.
• Partner with package, product, process, test and equipment engineers during NPI and production ramp-up.
• Assess reliability risks associated with material, equipment, supplier, process and package changes.
• Establish reliability-monitoring plans and early-warning mechanisms for abnormal product trends.
• Support supplier qualification and improvement programs for substrates, leadframes, mold compounds and other materials.
• Lead 8D, CAPA, FMEA and risk-assessment activities for product-quality and reliability issues.
• Prepare qualification reports, reliability summaries, risk assessments and customer-facing technical documentation.
• Support customer audits, quality reviews and technical discussions related to product and package reliability.
• Build and develop the quality and reliability engineering team.
• Ensure laboratory methods, equipment and records comply with internal and industry requirements.

Skills

Quality engineering

Reliability testing

Statistical data analysis

Root cause analysis

CAPA

FMEA

8D problem-solving

JEDEC standards knowledge

Education

Bachelor's or Master’s degree in Electronics/Electrical/Materials or related

Tools

JMP

Minitab

Job description

Quality and Reliability Manager Memory Products

Location: Ahmedabad, Gujarat, India

Work Mode: Onsite

Employment Type: Full-Time

Experience: 12 - 18 Years

Industry: Semiconductor / ATMP / OSAT / Memory Products

Role Overview

We are looking for a Quality and Reliability Manager to lead product-quality, package-reliability and qualification activities for memory products in a high-volume semiconductor assembly and test environment.

The role will own reliability strategy, qualification execution, product-health monitoring, failure analysis and corrective-action closure for DRAM, NAND and related memory products. The position requires strong semiconductor product-quality knowledge and experience working across packaging, assembly, test, product engineering, manufacturing and customer-quality functions.

Key Responsibilities

• Lead quality and reliability engineering for semiconductor memory products and package technologies.
• Develop product- and package-qualification strategies aligned with JEDEC and customer requirements.
• Define reliability test plans, qualification matrices, sample sizes, acceptance criteria and release requirements.
• Manage reliability testing, including HTOL, HAST/uHAST, temperature cycling, MSL and high-temperature storage.
• Review qualification results and approve products, packages, materials and process changes for manufacturing release.
• Monitor product-health, reliability, yield, defect and quality indicators during high-volume manufacturing.
• Lead investigation of reliability failures, manufacturing excursions, customer returns and field-quality issues.
• Coordinate electrical and physical failure analysis to identify package-, process-, material- and device-related causes.
• Drive root-cause analysis, containment, corrective action and recurrence-prevention activities.
• Partner with package, product, process, test and equipment engineers during NPI and production ramp-up.
• Assess reliability risks associated with material, equipment, supplier, process and package changes.
• Establish reliability-monitoring plans and early-warning mechanisms for abnormal product trends.
• Support supplier qualification and improvement programs for substrates, leadframes, mold compounds and other materials.
• Lead 8D, CAPA, FMEA and risk-assessment activities for product-quality and reliability issues.
• Prepare qualification reports, reliability summaries, risk assessments and customer-facing technical documentation.
• Support customer audits, quality reviews and technical discussions related to product and package reliability.
• Build and develop the quality and reliability engineering team.
• Ensure laboratory methods, equipment and records comply with internal and industry requirements.

Required Qualifications

• Bachelor s or Master s degree in Electronics, Electrical, Materials, Physics, Mechanical, Microelectronics Engineering or a related discipline.
• 12 18 years of semiconductor quality, product reliability, package reliability or qualification experience.
• At least 4 6 years of experience managing quality, reliability or failure-analysis engineers.
• Strong experience with semiconductor assembly, packaging and test operations.
• Knowledge of DRAM, NAND, NOR or other memory-product reliability is strongly preferred.
• Demonstrated experience planning and executing product and package qualification programs.
• Hands-on knowledge of accelerated reliability testing and failure mechanisms.
• Experience investigating qualification failures, manufacturing excursions and customer complaints.
• Strong understanding of statistical data analysis, quality systems and risk-management methodologies.
• Ability to support global teams and manufacturing escalations in a 24 7 production environment.

Technical Skills Memory Product Quality

• DRAM and NAND product quality
• Non-volatile memory reliability
• Product-health monitoring
• Yield and defect analysis
• Customer-quality management
• Manufacturing-quality controls
• Field-return analysis

Reliability Testing

• High-Temperature Operating Life
• Highly Accelerated Stress Test
• Unbiased HAST
• Temperature Cycling
• Thermal Shock
• Moisture Sensitivity Level
• High-Temperature Storage Life
• Low-Temperature Storage
• Board-Level Reliability
• Mechanical and environmental testing

Package Reliability

• Wire-bond reliability
• Intermetallic formation
• Delamination
• Package cracking
• Mold-compound and substrate interaction
• Solder-joint reliability
• Package warpage
• Electromigration and corrosion
• Thermal and mechanical stress

Failure Analysis

• Electrical failure analysis
• Optical microscopy
• X-ray inspection
• Scanning Acoustic Microscopy
• Decapsulation
• Cross-section analysis
• SEM/EDS
• Dye-and-pry analysis
• Thermal analysis
• Fault isolation
• Failure-mechanism identification

Quality and Statistical Tools

• 8D problem-solving
• Root-cause analysis
• CAPA
• FMEA
• Fault Tree Analysis
• Design of Experiments
• Statistical Process Control
• Process Capability Analysis
• Measurement System Analysis
• Weibull and reliability-data analysis
• JMP, Minitab or equivalent software

Standards and Compliance

• JEDEC reliability standards
• ISO 9001
• IATF 16949
• VDA 6.3
• Customer-specific quality requirements
• Change-control and qualification requirements

Leadership Responsibilities

• Build and lead a strong product-quality and reliability engineering organization.
• Assign ownership across qualification, reliability monitoring, failure analysis and customer-quality activities.
• Establish technical review, escalation and corrective-action mechanisms.
• Develop engineers through mentoring, technical training and competency planning.
• Coordinate resources during NPI, qualification, production ramp and critical quality incidents.
• Establish quality and reliability dashboards for senior-management review.
• Promote a culture of technical discipline, prevention and continuous improvement.

Key Performance Indicators

The Position Will Be Responsible For Improving