PWB Designer, Senior

Qualcomm; Hyderabad; On-site; INR 1,200,000 - 1,800,000; Full time

Job summary

Qualcomm India Private Limited is looking for a highly skilled candidate in PWB design solutions within the Corporate Engineering unit. The role includes collaborating with teams in the US and India, performing placement and routing activities, and creating assembly drawings for high-performance electronic assemblies for Mobile and IOT.

The successful individual will have substantial experience in PCB layout handling and a strong understanding of PWB design principles. Qualcomm values innovation and excellence, making this an exciting opportunity to contribute to cutting-edge technologies.

Qualifications

• 5+ years of PCB layout handling or related work experience.
• 6-9 years involved in PWB design for high-density electronics packaging.
• Experience designing consumer-grade mobile phones.

Responsibilities

• Provide PWB design solutions for high-performance electronic assemblies.
• Perform placement and routing activities using PWB CAD design software.
• Create fabrication and assembly drawings.

Skills

PWB design principles

PCB layout handling

High-speed digital circuits

EMI shielding

Education

Associate’s degree in Electrical Engineering or related field

High School diploma or equivalent

Tools

Valor

CAM350

Job description

Company

Qualcomm India Private Limited

Job Area

Engineering Services Group, Engineering Services Group > PWB Design

General Summary

The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to provide PWB design solutions for a variety of design types. For example: Product Test Engineering (PTE) designs – (UFLEX/IFLEX Probe cards, 93K DIB, Bench boards and Daughter Cards, Socketed and Solder down, HTOL, etc.) with multiple DUT sites up to 32X. Emulator designs – large/high density digital designs having high layer counts (24‑34 layers) and containing several FPGA’s (>1500 pins) along with very high‑speed digital signals. Reference handset designs – ‘form factor accurate’ (FFA) circuit boards. These boards require mastery in digital processors, RF and radio circuits as well as power control devices. Experience with micro‑vias (stacked), sequential lamination stack‑ups and design rules using .5mm pitch and smaller packages. Responsibilities include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem and IOT. Specific tasks include daily use of PWB CAD design software to perform placement and routing activities to meet mechanical and electrical design constraints and requirements. Exchange of electronic file transfers to/from mechanical and electrical engineers to ensure compliance to fit, form and function as well as power and signal integrity requirements. Creating fabrication and assembly drawings and working with internal teams and external suppliers to support PWB fabrication and assembly. The candidate will interface with internal staff and outside partners in the fast‑paced execution of a variety of multi‑disciplined projects. Leadership skills are expected on all projects to help direct, capture and interface with outside consultants.

Responsibilities

• Work with US and India teams to provide PWB design solutions for high-performance electronic assemblies for Mobile, Modem and IOT.
• Perform placement and routing activities using PWB CAD design software to meet mechanical and electrical design constraints and requirements.
• Exchange electronic file transfers to/from mechanical and electrical engineers to ensure compliance to fit, form and function and to meet power and signal integrity requirements.
• Create fabrication and assembly drawings and support PWB fabrication and assembly with internal teams and external suppliers.
• Interface with internal staff and outside partners in fast-paced execution of a variety of multi-disciplined projects.
• Provide leadership on all projects to help direct, capture and interface with outside consultants.
• Prepare and deliver design reviews to project teams.
• Communicate effectively with project peers and engineering personnel via e-mail, web meetings and instant messaging.
• Participate in determining objectives, plans and schedules for assignments and arrange own activities to accomplish objectives.
• Resolve PWB design issues with fabrication and assembly vendors and participate in process improvement, PWB and DFM checklists and guidelines.
• Maintain technical coordination with Engineering and Manufacturing and assist in determining objectives of assignments.
• Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.
• Multitask and meet aggressive schedules in a dynamic environment while preparing and delivering design reviews.

Minimum Qualifications

• Associate’s degree in Electrical Engineering, Computer Science, Mathematics, or related field and 5+ years of PCB layout handling or related work experience. OR High School diploma or equivalent and 7+ years of PCB layout handling or related work experience.
• 6‑9 years actively involved in PWB design for high-density electronics packaging.
• 6‑9 years experience in a PWB design role designing consumer-grade mobile phones utilizing latest generation processor chips.
• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.
• Design experience: RF, Analog, High-speed digital circuits – DDR2, DDR3 & DDR4, HDMI, PCIe, SATA, MIPI, USB 2, 3.x, GigE.
• ATA Platforms: 93K, UFlex and iFlex.
• Strong understanding and demonstrated application of PWB design principles, practices and standards.
• Ability to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.
• Develops solutions to a variety of complex problems and proposes PWB design trade-offs to the engineering design team for resolution and implementation.
• Determine PWB design trade-offs necessary to meet design requirements and produce high quality, cost-effective PWBs that meet schedule objectives.
• Understands the requirements driving PWB technology and process trends and their application to Qualcomm designs.
• Maintain technical coordination with Engineering and Manufacturing, resolve PWB design issues with fabrication and assembly vendors.
• Participate and provide input into process improvement, PWB and DFM checklists and guidelines.
• Experience working with on-board EMI shielding cans.
• Experience with IDF/EMN file exchange between mechanical and HW teams.
• Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
• Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.
• Effectively multitasks and meets aggressive schedules in a dynamic environment.
• Possess excellent verbal and written communication skills.
• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule; communicate milestones and directions to outside team members.

Equal Opportunity Employment

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process.

Compliance and Policies

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of company confidential information and other proprietary information, to the extent those requirements are permissible under applicable law.