PWB Designer, Senior

Qualcomm; Bengaluru; On-site; INR 1,000,000 - 1,500,000; Full time

Job summary

Qualcomm India Private Limited is seeking a skilled engineer in PWB design to join its Corporate Engineering unit. The role involves providing design solutions for high-performance electronics in mobile, modem, and IoT applications.

The successful candidate should excel in PWB CAD software, collaborate with US and India teams, and possess strong technical communication skills. A minimum of 5 years of experience in PCB layout and PWB design for consumer-grade mobile devices is required.

Qualifications

• 5+ years of PCB layout handling or related work experience.
• 6-9 years actively involved in PWB design for high-density electronics packaging.
• Experience with micro-vias and design rules utilizing .5mm pitch packages.

Responsibilities

• Provide PWB design solutions for high performance electronic assemblies.
• Conduct daily use of PWB CAD design software for placement and routing.
• Create fabrication and assembly drawings to support PWB fabrication.

Skills

PWB Design

Electrical Engineering

RF Circuits

High-speed digital circuits

Communication Skills

Education

Associate's degree in Electrical Engineering or related field

High School diploma

Tools

Valor

CAM350

Job description

Company

Qualcomm India Private Limited

Job Area

Engineering Services Group, Engineering Services Group > PWB Design

General Summary

The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to provide PWB design solutions for a variety of design types. For example: Product Test Engineering (PTE) designs - (UFLEX/IFLEX Probe cards, 93K DIB, Bench boards and Daughter Cards, Socketed and Solder down, HTOL, etc.) with multiple DUT sites up to 32X. Emulator designs - large/high density digital designs having high layer counts (24-34 layers) and containing several FPGA's (>1500 pins) along with very high-speed digital signals. Reference handset designs - 'form factor accurate' (FFA) circuit boards. These boards require mastery in digital processors, RF and radio circuits as well as power control devices. Experience with micro‑vias (stacked), sequential lamination stack‑ups and design rules using .5mm pitch and smaller packages. Responsibilities include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem and IOT. Specific tasks include daily use of PWB CAD design software to perform placement and routing activities to meet mechanical and electrical design constraints and requirements. Exchange of electronic file transfers to/from mechanical and electrical engineers to ensure compliance to fit, form and function as well as power and signal integrity requirements. Creating fabrication and assembly drawings and working with internal teams and external suppliers to support PWB fabrication and assembly. The candidate will interface with internal staff and outside partners in the fast‑paced execution of a variety of multi‑disciplined projects. Leadership skills are expected on all projects to help direct, capture and interface with outside consultants.

Minimum Qualifications

• Associate's degree in Electrical Engineering, Computer Science, Mathematics, or related field and 5+ years of PCB layout handling or related work experience.


• OR High School diploma or equivalent and 7+ years of PCB layout handling or related work experience.


• 6-9 years actively involved in PWB design for high‑density electronics packaging.


• 6-9 years experience in a PWB design role designing consumer‑grade mobile phones utilizing latest generation processor chips.


• Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools.


• Design experience: RF, Analog, High‑speed digital circuits - DDR2, DDR3, DDR4, HDMI, PCIe, SATA, MIPI, USB 2, 3.x, GigE.


• ATE Platforms: 93K, uFlex and iFlex.


• Strong understanding and demonstrated application of PWB design principles, practices and standards.


• Ability to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.


• Develops solutions to a variety of complex problems and proposes PWB design trade‑offs to the engineering design team for resolution and implementation.


• Determines PWB design trade‑offs necessary to meet design requirements and produce high‑quality, cost‑effective PWBs that meet schedule objectives.


• Understands the requirements driving PWB technology and process trends and their application to Qualcomm designs.


• Maintains technical coordination with Engineering and Manufacturing; resolves PWB design issues with fabrication and assembly vendors.


• Participates in process improvement, PWB and DFM checklists and guidelines.


• Determines objectives of assignments and plans, schedules and arranges own activities to accomplish objectives.


• Experience working with on‑board EMI shielding cans.


• Experience with IDF/EMN file exchange between mechanical and HW teams.


• Understands project goals and individual contribution toward those goals.


• Effectively communicates with project peers and engineering personnel via e‑mail, web meetings, and instant messaging including status reports and illustrative presentation slides.


• Interacts and collaborates with other internal PWB designers for optimal product development processes and schedule execution.


• Effectively multitasks and meets aggressive schedules in a dynamic environment.


• Prepares and delivers design reviews to project team.


• Possesses excellent verbal and written communication skills.


• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule; communicates milestones and directions to outside team members.

Applicants

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e‑mail disability‑[e-mail] or call Qualcomm's toll‑free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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