Principal, IC Package Engineer

Microchip Technology; India; On-site; INR 4,000,000 - 7,000,000; Full time

Benefits offered by this job

Travel 0-25%

Job summary

Microchip Technology Inc. in India seeks a senior package design engineer to lead high-speed analog/mixed-signal packaging projects and drive advanced packaging strategies.

You will collaborate with signal integrity, reliability and external vendors, leveraging Cadence APD and APD design rules while mentoring teams. The role requires 10+ years of experience and familiarity with flip chip, wire bond, and BGA fanout issues, plus travel up to 25%.

Qualifications

• Bachelor's or Master's Degree required.
• 10+ years of industry experience in package design.
• Expert in package design using Cadence APD.
• Expert in authoring APD design rules.
• Scripting in PERL or SKILL is an asset.
• Familiarity with flip chip and wire bond package designs.
• Familiarity with PCB design and BGA fanout issues.
• Understanding of high speed and power routing rules/issues.
• Capable of handling multiple tasks at once.
• Customer oriented with attention to detail.

Responsibilities

• Conduct package routing feasibility and substrate layouts for high-speed products including MCM packages.
• Perform simple PCB breakout studies for ball map feasibility.
• Identify key issues based on silicon floor plans and package sizes.
• Collaborate with signal integrity engineers to implement high-speed signal routes and quiet power routes.
• Coordinate with reliability engineers and external vendors for manufacturability of package designs.
• Create package routing constraints based on signal integrity routing rules.
• Interact with and oversee external and internal package designers.
• Produce package routing reports and diagrams for review by external teams.
• Create and track package design schedules.
• Guide and assist external design teams on data input for package design flow.

Skills

Customer oriented

Attention to detail

Multitasking

High-speed routing knowledge

Power routing knowledge

Education

Bachelor's or Master's Degree

Tools

Cadence APD

APD design rules

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values ; we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description

The Mixed Signal Development Group is responsible for delivering high-speed analog and mixed-signal IP to divisions within Microchip. We work with leading edge CMOS processes to produce analog integrated circuits for wireline applications. From PCIe to 128+Gb/s SERDES, we enable technology that allows Microchip's products to interface to the outside world.

Responsibilities

• Conduct package routing feasibility and substrate layouts for Microchip high-speed products, including MCM packages
• Perform simple PCB breakout studies for ball map feasibility
• Identify key issues for proposed designs based on silicon floor plans and desired package sizes
• Work with signal integrity engineers to implement high speed signal routes and quiet power routes
• Work with reliability engineers and external vendors to ensure manufacturability of package designs
• Create package routing constraints based on signal integrity routing rules
• Interact with and oversee work of external and internal package designers
• Produce package routing reports and diagrams for review by external teams
• Create and track package design schedules
• Guide and assist external design teams on creation of input data for package design flow.

Requirements/Qualifications

• Applicable Bachelor's or Master's Degree
• 10+ years of industry experience
• Expert in package design using Cadence APD
• Expert in authoring APD design rules
• Scripting in PERL or SKILL is an asset
• Familiarity with flip chip and wire bond package designs
• Familiarity with PCB design and BGA fanout issues
• Understanding of high speed and power routing rules/issues
• Capable of handling multiple tasks at once
• Customer oriented, with attention to detail

Travel Time

0% - 25%