PCB Design Engineer

Fi NOW; India; On-site; INR 800,000 - 1,200,000; Full time

Benefits offered by this job

Work on innovative high-frequency systems

Collaborate with a global team

Real-world deployment of designs

Job summary

Fi NOW is seeking a PCB Design Engineer to drive innovation in high-frequency systems for next-generation wireless technologies. You will transform high-frequency concepts into manufacturable high-performance boards, collaborating closely with hardware teams.

The ideal candidate holds a B.S. or M.S. in Electrical Engineering and has at least 2 years of relevant PCB design experience. Join us and contribute to the advancement of wireless communications!

Qualifications

• 2+ years of PCB design experience (academic, internship, or industry).
• Experience designing multilayer boards with RF and high-speed digital interfaces.
• Familiarity with SI/PI and EM simulation tools (e.g., ADS Momentum, HFSS).

Responsibilities

• Turn high-frequency concepts into manufacturable boards.
• Collaborate with IC, packaging, and systems engineering teams.

Skills

Hands-on experience with Altium Designer

Understanding of RF layout

Strong communication skills

Education

B.S. or M.S. in Electrical Engineering

Focus on RF/microwave, high-speed digital

Tools

Altium Designer

Cadence Allegro

Siemens Expedition

Job description

Are you passionate about RF, microwave, and high-speed PCB design? At Sivers Semiconductors, we’re driving innovation in beamformer ICs, transceiver modules, and active antenna arrays for next-generation wireless systems.

As our PCB Design Engineer, you’ll turn high-frequency concepts into manufacturable, high-performance boards, collaborating with IC, packaging, and systems engineering teams. Your work will directly impact 5G/6G, SATCOM, and radar technologies used around the globe.

What You Bring:

• Hands-on experience with Altium Designer, Cadence Allegro, or Siemens Expedition
• Strong understanding of RF layout, impedance-controlled interconnects, and signal/power integrity
• Passion for building cutting-edge, high-performance PCBs
• Collaborative mindset to work with design, test, and systems teams

Why Sivers:

• Work on innovative high-frequency systems shaping the future of wireless communications
• Collaborate with a global, high-performance team
• See your designs move from concept to real-world deployment

Qualifications:

• B.S. or M.S. in Electrical Engineering (or related field) with a focus on RF/microwave, high-speed digital, or mixed-signal design.
• 2+ years of PCB design experience (academic, internship, or industry).
• Proficiency with one or more major PCB CAD platforms: Altium Designer, Cadence Allegro, or Siemens Expedition.
• Strong understanding of controlled-impedance routing, via design, grounding, and RF isolation techniques.
• Experience designing multilayer boards with RF and high-speed digital interfaces (e.g., SERDES, LO distribution, IF routing).
• Familiarity with SI/PI and EM simulation tools (e.g., ADS Momentum, HFSS, Si9000, Sigrity).
• Excellent communication, documentation, and cross-disciplinary collaboration skills.

Apply Today and help us push the boundaries of next-generation wireless technology!