Package Architect

Tsavorite Scalable Intelligence, Inc.; Bengaluru; On-site; INR 1,500,000 - 2,300,000; Full time

Job summary

Tsavorite Scalable Intelligence, Inc. in Bengaluru, India, is seeking a senior Senior Package Design Engineer to drive leading-edge AI product packaging from concept to tape-out.

You will own substrate layout, coordinate cross-functional teams, and enable high-performance interfaces across silicon, package, and board. The role requires 16+ years in flip-chip BGA design, expertise in high-speed Serdes and memory interfaces, and hands-on experience with Mentor Xpedition.

Qualifications

• More than 16+ years of experience in flip chip BGA package design.
• Experience with large form-factor designs, high layer counts, stack-up definition, bump and ball map definition, and package outline drawings.
• Strong understanding of package design rules, design for manufacturing, and tape-out of multiple designs.
• Knowledge of package-level signal integrity and power integrity.
• Experience with high-speed Serdes (PCIe Gen6, 112-224 G Ethernet) and memory interfaces (DDR5, LPDDR, HBMs).
• Mentor Xpedition experience is preferred.

Responsibilities

• Own the substrate layout design from start to finish and tape out multiple products.
• Feasibility studies for new IP definitions and package design concepts.
• Co-design between Silicon, package and board; interface with SI/PI leads and PCB/mechanical teams to meet requirements.
• Collaborate with OSAT/Packaging suppliers to ensure DFM, review designs, and document BOM.

Skills

Flip chip BGA design

Large form factor

Stack-up definition

Bump and ball map definition

Package outline drawings

Design for manufacturing

Signal integrity

High speed Serdes (PCIe Gen6)

DDR5/LPDDR/HBM interfaces

Tools

Mentor Xpedition

Job description

Founded in 2023,by Industry veterans HQ in California,US

Company Description:

We are product based startup. The products are chipsets and intelligent machines that enable scalable enterprises AI, streaming video intelligence, training trillion parameter models, and fine-tuning LLMs, allowing enterprises to improve productivity with advanced solutions. We are looking for exceptional talent and leadership to join our organization, the world’s first company developing Agentic Silicon for powering the future of AI.

We are pioneering a new era in AI innovation focused on accelerating the

adoption of end-to-end enterprise AI, from the edge to Zettascale systems.

Our cutting-edge Software and composable silicon Chiplets will transform the way AI models are Trained, Deployed, and Scaled.

"Join Our Growing Team!"

We are building a world-class team to drive innovation in AI Silicon & Software and hiring for below position in Bangalore

Key Links to Include

• Recent News: Tsavorite Emerges with $100M in Orders & 10x Performance (Forbes)

Qualifications:

• More than 16+ years of experience in the flip chip BGA package design
• Experience working on the Large Formfactor, high layer count designs, Stack-up definition, Bump and ball map definition, Package outline drawings
• Very good understanding of the package design rules as well as design for manufacturing and successful tape out of multiple designs.
• Knowledge of Package level signal integrity and power integrity.
• Worked on High speed Serdes(PCIE Gen6, 112-224 G Ethernet) and memory interface like DDR5, LPDDR and HBM.
• Mentor Xpedition experience is preferred.

Responsibilities:

• Responsible for the package design of the Leading edge AI products for Tsavorite.
• Responsible for the feasibility studies for the new IP definition and Package design concepts.
• Owning the substrate layout design from start to end and taping out multiple products
• Co-design between Silicon, package and board.
• Collaborate closely with the Signal integrity, power integrity leads, PCB design, Mechanical and thermals to optimize the design to meet the product requirements.
• Interface with the OSAT/Packaging suppliers to understand the design rules, review the package design, meet DFM requirements and Documentation of BOM.