OSAT Manager

HCL Technologies Limited; Bengaluru; On-site; INR 2,000,000 - 4,200,000; Full time

Job summary

HCL Technologies Limited is seeking an experienced OSAT Interface Manager to oversee end-to-end engagement with OSAT partners across semiconductor packaging, assembly, testing, qualification, yield improvement, NPI, and production ramp.

The role requires extensive collaboration with internal teams and OSATs to drive packaging development, test readiness, and manufacturing readiness for high-reliability semiconductor products.

Qualifications

• 10+ years in semiconductor packaging / assembly / product engineering / test / OSAT operations.
• Strong hands-on experience working directly with OSATs.
• Good knowledge of QFN/QFP/BGA packaging and wire-bond assembly.
• Experience taking semiconductor products through NPI → Qualification → Production Ramp.
• Strong knowledge of yield improvement, failure analysis, and quality management.
• Automotive semiconductor / AEC-Q100 experience is highly desirable.
• Exposure to OSAT companies such as ASE, Amkor, JCET, UTAC, SPIL, or equivalent is preferred.

Responsibilities

• Act as the primary technical interface with OSAT partners.
• Manage package development, assembly, final test, qualification, and production readiness.
• Support package technologies including QFN, QFP, BGA.
• Drive assembly processes covering die attach, wire bonding, molding, leadframe/substrate, marking, singulation, and package inspection.
• Manage OSAT NPI milestones, engineering builds, pilot builds, and production release.
• Coordinate test-program and tester/interface readiness.
• Monitor assembly/test yield and drive yield improvement.
• Lead failure analysis, root-cause analysis, 8D, corrective and preventive actions.
• Coordinate package qualification and reliability activities including HTOL, HAST/uHAST, temperature cycling, MSL, wire-bond reliability, and package integrity.
• Manage OSAT schedules, risks, capacity, NRE/tooling, assembly and test costs.
• Coordinate across Engineering, Quality, Procurement, Operations, and Customer teams.

Skills

OSAT Partner Management

Semiconductor Packaging

NPI & Production Ramp

Yield Improvement

Failure Analysis

Tools

QFN

QFP

BGA

Job description

We are looking for an experienced OSAT Interface Manager to manage end-to-end engagement with OSAT partners across semiconductor packaging, assembly, testing, qualification, yield improvement, NPI, and production ramp.

Locations: India | Malaysia | Taiwan

Email:[e-mail]

Key Responsibilities

• Act as the primary technical interface with OSAT partners
• Manage package development, assembly, final test, qualification, and production readiness
• Support package technologies including QFN, QFP, BGA
• Drive assembly processes covering die attach, wire bonding, molding, leadframe/substrate, marking, singulation, and package inspection
• Manage OSAT NPI milestones, engineering builds, pilot builds, and production release
• Coordinate test-program and tester/interface readiness
• Monitor assembly/test yield and drive yield improvement
• Lead failure analysis, root-cause analysis, 8D, corrective and preventive actions
• Coordinate package qualification and reliability activities including HTOL, HAST/uHAST, temperature cycling, MSL, wire-bond reliability, and package integrity
• Manage OSAT schedules, risks, capacity, NRE/tooling, assembly and test costs
• Coordinate across Engineering, Quality, Procurement, Operations, and Customer teams

What We’re Looking For

10+ years in semiconductor packaging / assembly / product engineering / test / OSAT operations

Strong hands-on experience working directly with OSATs

Good knowledge of QFN/QFP/BGA packaging and wire-bond assembly

Experience taking semiconductor products through NPI → Qualification → Production Ramp

Strong knowledge of yield improvement, failure analysis, and quality management

Automotive semiconductor / AEC-Q100 experience is highly desirable

Exposure to OSAT companies such as ASE, Amkor, JCET, UTAC, SPIL, or equivalent is preferred

Catchy Tagline Options

Option 1 – Technical

From Silicon to Production – Lead the OSAT Journey!

Own the OSAT Interface. Drive NPI. Enable Production Excellence.

Option 3 – LinkedIn-friendly

Semiconductor Packaging Experts – Your Next Leadership Opportunity Is Here!