Mechanical Simulation Engineer - Advanced Packaging

Micron; Hyderabad; On-site; INR 900,000 - 1,500,000; Full time

Job summary

Micron Technology, Inc. in Hyderabad seeks a Mechanical Simulation Engineer to drive thermo‑mechanical and multiphysics modeling for advanced semiconductor packaging, including HBM, 2.5D, and 3D integration.

You will enhance predictive analytics, automate simulations, and collaborate with cross-functional teams to influence design decisions. 2–5 years in mechanical/materials engineering with AI-driven modelling or data-driven techniques is preferred, with a focus on delivering robust, efficient

Qualifications

• 2–5 years in Mechanical/Materials engineering in semiconductor or advanced packaging.
• Experience with AI-driven modeling, automation or data-driven simulation preferred.
• Strong fundamentals in materials and reliability for packaging.

Responsibilities

• Perform linear and non-linear static analysis for package and material behaviour.
• Develop multiphysics models (thermo-mechanical, thermal, structural, fluidic).
• Integrate AI/ML for surrogate modelling and design optimisation.
• Create automation workflows for simulation setup, solve and post-processing.
• Collaborate with cross-functional teams across packaging and fabrication.

Skills

Multiphysics simulation

Thermo-mechanical analysis

AI-driven modelling

Automation workflows

Education

Bachelor's degree in Mechanical Engineering

Tools

FEM/FEA tools

Python/ scripting

Job description

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Mechanical Simulation Engineer, you will drive thermo‑mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterisation, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimise modelling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modelling capabilities. You will collaborate with cross‑functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions.

Job Responsibilities

• Perform linear and non‑linear static analysis for package and material behaviour
• Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages
• Develop multiphysics models (thermo‑mechanical, thermal, structural, fluidic)
• Model interfaces including contact, shear, delamination, and interfacial damage
• Integrate Generative AI, AI Assistant tools, and Artificial Intelligence for simulation acceleration and optimisation
• Apply AI/ML techniques for surrogate modelling, reduced‑order modelling, and design optimisation
• Develop and deploy automation workflows for simulation set‑up, solve, and post‑processing
• Leverage data‑driven methods to enhance model fidelity and reduce turnaround time
• Support development of HBM, 2.5D/3D packages, TSV, and hybrid bonding technologies
• Understand fabrication and assembly processes such as thermo‑compression bonding, reflow, and wafer bonding
• Develop material models for polymers, composites, and thin‑film stacks
• Drive material characterisation workflows and validation
• Perform failure and reliability analysis including fatigue life and crack propagation
• Collaborate with global cross‑functional teams

Experience

2-5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging domains, with experience in AI‑driven modelling, automation, or data‑driven simulation techniques preferred.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high‑performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data centre to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, colour, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact [e-mail]

Micron Prohibits the use of child labour and complies with all applicable laws, rules, regulations, and other international and industry labour standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.