Mechanical Packaging Design Engineer

Hardstone Electric (opc); Bengaluru; On-site; INR 900,000 - 1,300,000; Full time

Job summary

Hardstone Electric (opc) seeks a Mechanical Packaging Design Engineer to lead PCB mechanical packaging, thermal, and enclosure design for high-voltage power electronics systems.

You will drive from ruggedized enclosure concepts to full box-build architectures, partnering with electrical teams to optimize space, cooling, and manufacturability in a contract role based in Bengaluru.

Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering.
• 3+ years in mechanical design for power electronics packaging or ruggedized enclosures.
• Proficiency in CAD: SolidWorks, Creo or Fusion; FreeCAD preferred.
• Fundamentals of thermal-fluid dynamics and basic simulation tools.
• Knowledge of high-voltage isolation, creepage/clearance, conductor routing.
• Experience in sheet metal fabrication, CNC, die casting, and plastic molding.

Responsibilities

• Enclosure and box-build design for high-power/high-voltage systems.
• Collaborate with electrical teams to manage board boundaries and clearances.
• Develop thermal management solutions including heatsinks and cooling paths.
• Perform DFMEA and ensure rugged performance under environmental stress.
• Optimize for DFA/DFM to reduce assembly and manufacturing costs.
• Prototype, test, and validate mechanical performance with validation teams.
• Create detailed 2D drawings with GD&T and accurate BOMs.

Skills

Power electronics packaging

Ruggedized enclosures

Box builds

SolidWorks

PTC Creo

Autodesk Fusion

FreeCAD

Thermal engineering

High-voltage isolation

DFM / DFA

Sheet metal fabrication

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

Ansys Icepak

SolidWorks Flow Simulation

Job description

Job Title: Mechanical Packaging Design Engineer

Location: Bengaluru - Karnataka

Department: Hardware and Power Electronics Engineering

Employment Type: Contract

Experience Level: Mid level [3-5 Years]

Job Summary:

We are seeking an experienced Mechanical Packaging & Design Engineer to spearhead PCB mechanical packaging, thermal, and enclosure design for our high voltage power electronics systems. In this role, you will lead the transition from raw electronics into fully integrated, ruggedized product assembliesspanning sheet metal and plastics enclosure design, plastic parts, busbars, Hearsinks and thermal management, and full box-build architectures. You will collaborate seamlessly with the electrical engineering and PCB layouts’ team to manage tight spatial footprints, optimize advanced cooling mechanisms, and deliver high-yield production packages.

Key Responsibilities:

• Enclosure & Box Build Design: Design robust mechanical enclosures (sheet metal, die-cast aluminum, injection-molded plastics) housing high-power and high-voltage components, wire harnesses, connectors, and PCB assemblies.
• ECAD/MCAD Collaboration: Collaborate intimately with the electrical layout team to manage physical board boundaries, component clearances, high-voltage creepage/clearance distances, and copper busbar integration.
• Thermal Management Systems: Develop and optimize advanced passive and active thermal management strategies, designing custom heatsinks, cold plates, phase-change materials, and airflow paths to dissipate high thermal loads.
• Structural Integration & Stress Analysis: Perform structural, shock, vibration, and tolerance analysis (DFMEA) to ensure the system withstands rugged environmental conditions and complies with transportation/operational standards.
• Design for Excellence (DFX): Optimize parts heavily for Design for Assembly (DFA) to reduce labor time in box builds, and Design for Manufacturing (DFM) across diverse fabrication methods.
• Prototyping & Testing: Build and test mechanical prototypes. Collaborate with validation teams to evaluate thermal and mechanical performance under extreme stress conditions.
• Manufacturing Documentation: Generate complete, detailed 2D engineering drawings with geometric dimensioning and tolerancing (GD&T) alongside accurate Bill of Materials (BOMs) for the complete box build.

Required Qualifications & Skills:

• Education: Bachelor’s or Master’s degree in Mechanical Engineering or a related technical discipline.
• Experience: 3+ years of mechanical design experience specifically focused on power electronics packaging, ruggedized enclosures, or heavy industrial box builds.
• CAD Proficiency: Mastery of 3D mechanical CAD software such as SolidWorks, PTC Creo, or Autodesk Fusion. FreeCAD Preffered
• Thermal Engineering: Solid foundational knowledge of thermal fluid dynamics and experience setting up basic thermal/structural simulation tools (FEA/CFD).
• Power Electronics Literacy: Strong understanding of mechanical requirements unique to high power, including high-voltage isolation, creepage and clearance metrics, and conductor routing.
• Manufacturing Knowledge: Proven experience designing for manufacturing processes including sheet metal fabrication, CNC machining, die casting, and plastic injection molding.

Good-to-Have Qualifications:

• Experience with specialized simulation suites (e.g., Ansys Icepak, SolidWorks Flow Simulation).
• Familiarity with industry safety standards (e.g., UL, CE, IPC-A-610 for box build acceptability).
• Knowledge of environmental testing standards (e.g., IP rating certifications for water/dust ingress, EMI/EMC).