Mechanical Engineer, Senior

Qualcomm; Bengaluru; On-site; INR 1,000,000 - 1,500,000; Full time

Job summary

Qualcomm in Bengaluru is looking for a Mechanical Engineer to join their Central Hardware Systems department. The role involves designing high-performance electronic assemblies for various applications including Mobile and IOT. Candidates should have a Bachelor's degree in Mechanical Engineering and at least 2 years of relevant experience.

Responsibilities include using Creo for modeling and design, as well as collaborating with cross-functional teams. Strong verbal and written communication skills, along with leadership abilities, are required for successful project execution.

Qualifications

• Bachelor's degree in Mechanical Engineering or related field and 2+ years of experience.
• 6+ years in mechanical engineering, thermal engineering and electronics packaging design.
• Experience in a mechanical design engineering role designing electronics products.

Responsibilities

• Work with US and India teams to design electronic assemblies.
• Daily use of Creo for modeling, layouts, and design specifications.
• Interface with teams for thermal analysis and project execution.

Skills

Mechanical Engineering

Thermal Engineering

Solid modeling using Creo

Tolerance analysis

Cross-functional teamwork

Education

Bachelor's degree in Mechanical Engineering

Master's degree in Mechanical Engineering

PhD in Mechanical Engineering

Tools

Creo

Job description

Job Overview

The successful candidate will operate as a member of Central Hardware Systems department. Responsibilities include working with US and India teams to conceptualize and design high performance electronic assemblies for Mobile, Modem, Compute, Auto, IOT etc. Specific tasks include daily use of Creo solid modeling software, concept layouts, defining rigid and flexible circuit board outline and mounting constraints, electronic file transfers to/from circuit board CAD designers, shielding/gasket design, design of mechanical parts and system assemblies, creating detailed mechanical drawings, specifying dimensional tolerances and tolerance stackups, creating BOMs for assemblies, working with internal teams for optimal selection of batteries, displays, and audio components, working with internal machine shop for prototypes, and working with external suppliers for design collaboration and fabrication, including injection molded tooling. Candidate with knowledge on basics of thermal analysis and simulations will have preference. The candidate will interface with internal staff and outside partners in the fast‑paced execution of a variety of multi‑disciplined projects. Leadership skills are expected on all projects to help direct, capture and interface with outside consultants.

Minimum Qualifications

• Bachelor's degree in Mechanical Engineering or related field and 2+ years of Mechanical Engineering or related work experience.
• Master's degree in Mechanical Engineering or related field and 1+ year of Mechanical Engineering or related work experience.
• PhD in Mechanical Engineering or related field.

Minimum Qualifications (Experience Based)

• 6+ years actively involved in mechanical engineering, Thermal Engineering and design of high‑density electronics packaging.
• Experience in a mechanical design engineering role designing electronics products / systems.
• Solid modeling experience utilizing Creo.

Preferred Qualifications

• Expected to possess a strong understanding of mechanical engineering, thermal engineering and design fundamentals.
• Experience with defining outline, mounting, and I/O constraints of electronic circuit boards.
• Demonstrated ability for tolerance analysis and specification, including GD&T fundamentals.
• Demonstrated success in working with HW, component engineering, and other cross functional teams.
• Demonstrated success in working with HW and thermal analysis teams for appropriate thermal mitigation techniques.
• Solid understanding of design fundamentals for CNC, injection molded and stamped metal parts.
• Demonstrated ability working with supplier base for successful design collaboration and volume production.
• Strong experience with Creo solid model assembly, part, and drawing creation and Data storage.
• Experience with top‑down skeleton model structuring and master model design techniques within Creo.
• Experience with IDF/EMN file exchange between mechanical and HW teams.
• Understands project goals and individual contribution toward those goals.
• Effectively communicates with project peers and engineering personnel via e‑mail, web meetings, and instant messaging including status reports and illustrative presentation slides.
• Interact and collaborate with other internal mechanical engineers for optimal product development processes and schedule execution.
• Possess excellent verbal and written communication skills.
• Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members.

Education Requirements

Bachelor Degree, Mechanical Engineering required.

Equal Opportunity and Legal Statement

Qualcomm is an equal opportunity employer and provides reasonable accommodations for individuals with disabilities. Applicants must comply with company policies regarding security and confidentiality.