Mechanical Design Engineer

Ceragon Networks; Bengaluru Urban; On-site; INR 2,500,000 - 4,000,000; Full time

Job summary

Ceragon Networks is seeking a packaging design engineer in Bengaluru, India with 5+ years of electronics packaging experience. The role focuses on design for manufacturing, thermal analysis, GD&T, BOM management, and mentoring junior engineers.

Proficiency in SolidWorks and English communication are required to coordinate across global teams. Experience with RF equipment awareness and PLM systems will be advantageous as you contribute to full lifecycle projects and cross-functional collaboration

Qualifications

• BE in Mechanical Engineering from an accredited university; ME an advantage.
• At least 5 years of experience in electronics packaging design.
• Strong understanding of GD&T, drawings, assembly tolerances - must.
• Proficiency in SolidWorks - must.
• Proficiency in writing as well as speaking in English.
• Must be self-motivated, able to work under pressure, and multitask.
• Team player with strong technical and communication skills.

Skills

DFM

Electronic packaging design

Mechanical design

Thermal analysis

GD&T

BOM structuring

PLM systems

Mentoring engineers

RF equipment awareness

Education

BE in Mechanical Engineering

ME an advantage

Tools

SolidWorks

Job description

Job Description

Ceragon is the global innovator and leading solutions provider of end-to-end wireless connectivity, specializing in transport, access, and AI-powered managed & professional services. Through our commitment to excellence, we empower customers to elevate operational efficiency and enrich the quality of experience for their end users.

Ceragon is the global innovator and leading solutions provider of end-to-end wireless connectivity, specializing in transport, access, and AI-powered managed & professional services. Through our commitment to excellence, we empower customers to elevate operational efficiency and enrich the quality of experience for their end users.

Our customers include service providers, utilities, public safety organizations, government agencies, energy companies, and more, who rely on our wireless expertise and cutting-edge solutions for 5G & 4G broadband wireless connectivity, mission-critical services, and an array of applications that harness our ultra-high reliability and speed.

Ceragon solutions are deployed by more than 600 service providers and over 1,600 private network owners across more than 130 countries.

Through our innovative end-to-end portfolio spanning hardware, software, managed services, and professional services, Ceragon enables customers to embrace the future of wireless technology with confidence while delivering reliable, high-capacity, and cost-effective connectivity solutions worldwide.

• Experience in design for manufacturing (DFM) including plastic injection molding, metal casting, machining, stamping, and forming
• Experience in electronic packaging design
• Experience in Electro Mechanical Integration
• Experience in leading full life cycle projects
• Experience with PLM systems, engineering changes, BOM structuring, etc.
• Experience in design of indoor and outdoor equipment
• Experience in thermal, dynamical and statical design and analysis
• Experience in design of telecommunication/RF equipment – an advantage
• Experience in mentoring engineers – an advantage
• Perform analysis, testing, design iterations, and validation of the designs

Job Requirements

• Qualification: BE in Mechanical Engineering from an accredited university. ME an advantage
• At least 5 years of experience in electronics packaging design
• Strong understanding of GD&T, drawings, assembly tolerances - must
• Proficiency in SolidWorks - must
• Proficiency in writing as well as speaking in English
• Must be self-motivated, able to work under pressure, and multitask
• Team player with strong technical and communication skills