Mechanical Design And Thermal Engineer

AsiaCruit, Inc.; New Delhi; Vor Ort; INR 1.200.000 - 1.800.000; Vollzeit

Zusammenfassung

Asiacruit in New Delhi, India seeks a Mechanical Design & Thermal Engineer to design and optimize weatherproof enclosures and thermal systems for advanced outdoor robotic platforms. You will work with multidisciplinary teams to support mechanical design, simulations, and hardware integration.

The role focuses on protecting sensitive electronics from harsh environments, heat, and impacts while ensuring reliable system performance.

Qualifikationen

• Bachelor's or Master's degree in Mechanical Engineering or related field.
• 3–5 years of relevant engineering experience.
• Proven experience designing sealed enclosures for outdoor robotics or ruggedized electronics.
• Strong CAD and simulation skills.

Aufgaben

• Design lightweight, weatherproof enclosures and sensor housings for rugged outdoor robotics.
• Develop thermal management solutions for high-performance computing and motor components.
• Perform FEA and vibration isolation modeling for LiDAR, cameras, and computing boards.
• Conduct thermal-fluid simulations and structural analyses for enclosure performance.
• Collaborate with external partners on CoG distribution, payload mounting, and outer-shell integration.
• Troubleshoot packaging, thermal, and vibration issues during hardware integration.

Kenntnisse

Mechanical design

Team collaboration

Problem solving

Ausbildung

Bachelor's or Master’s in Mechanical Engineering

Tools

SolidWorks

PTC Creo

Siemens NX

Ansys Fluent

Jobbeschreibung

Job Description:

About Asiacruit

Asiacruit is a global talent acquisition and recruitment company that connects skilled professionals with companies across various industries. We help candidates explore career opportunities aligned with their experience, skills, and professional goals.

Position Overview

We are looking for a Mechanical Design & Thermal Engineer to design and optimize mechanical enclosures, structural components, and thermal management systems for advanced outdoor robotic platforms. This role focuses on protecting sensitive electronics and sensors from harsh environmental conditions, heat, and repeated mechanical impacts while ensuring reliable system performance.

You will work with multidisciplinary engineering teams and external technical partners to support mechanical design, simulation, and hardware integration.

Key Responsibilities

• Design lightweight, weatherproof IP65/IP67-rated enclosures, sensor housings, and shock-isolated electronics compartments for rugged outdoor robotic applications.
• Develop passive and active thermal management solutions to dissipate heat from high-performance computing systems, including NVIDIA Jetson Orin platforms, and motor components operating under demanding outdoor conditions.
• Perform Finite Element Analysis (FEA) and vibration isolation modeling to protect LiDAR sensors, optical cameras, and computing boards from repeated impacts during robot locomotion.
• Conduct thermal-fluid simulations and structural analysis to evaluate heat dissipation, mechanical strength, and enclosure performance.
• Collaborate with external mechanical engineering partners on center-of-gravity (CoG) distribution, payload mounting, and outer-shell integration.
• Troubleshoot mechanical packaging, thermal management, and vibration-related issues during hardware integration and testing.

Qualifications

• Bachelors or Masters degree in Mechanical Engineering or a related field.
• 3–5 years of relevant engineering experience.
• Proven experience designing sealed enclosures for outdoor robotics, defense electronics, or other ruggedized electronic systems.
• Proficiency in CAD software such as SolidWorks, PTC Creo, or Siemens NX.
• Strong understanding of thermal management, computational fluid dynamics (CFD), and structural analysis, preferably using Ansys Fluent or equivalent tools.
• Practical knowledge of ingress protection, vibration isolation, and mechanical integration.
• Ability to work collaboratively across mechanical, electrical, and embedded systems engineering teams.

Why Join?

• Contribute to the development of advanced robotic platforms designed for demanding outdoor environments.
• Solve practical engineering challenges involving thermal performance, ruggedized enclosures, and mechanical reliability.
• Collaborate with multidisciplinary engineering teams on integrated robotic hardware systems.
• Apply your CAD, simulation, and engineering expertise to real-world robotics applications.

Work Location & Arrangement

On-site at the robotics R&D facility in New Delhi, India.