ISP Program Manager

Tata Electronics; Mayang; On-site; INR 1,800,000 - 5,200,000; Full time

Job summary

Tata Electronics is seeking a Program Manager – OSAT to lead large, complex customer programs from concept through high-volume manufacturing. You will integrate customer requirements with engineering, supply chain, and factory operations to ensure on-time, on-cost, and on-quality delivery.

The role focuses on operations readiness for new products, including capacity planning, qualification, ramp management, and cross-functional alignment in an outsourced semiconductor assembly and test

Qualifications

• Bachelor’s degree in Engineering or related field is required.
• 15+ years of experience in semiconductor manufacturing, OSAT or advanced packaging.
• Experience in NPI and HVM ramp with direct customer ownership.
• Knowledge of assembly & test processes (e.g., wire bond, flip chip, WLCSP, BGA, SiP).
• Experience with semiconductor quality systems (APQP, FMEA, Control Plans, 8D).
• Strong knowledge of manufacturing operations, capacity planning, and yield management.
• Experience in supply chain coordination and material readiness.
• Proficient in cost modeling and program financial management.
• Excellent stakeholder management and ability to influence cross-functional teams.

Responsibilities

• Own end-to-end execution of multiple customer programs within the OSAT unit.
• Interface with customers and internal teams for scope, schedule, and performance.
• Develop and maintain integrated program schedules, milestones, and deliverables.
• Drive governance, risk reviews, and executive reporting.
• Manage program financials including cost optimisation and margins.

Skills

NPI & HVM ramp

OSAT/Advanced packaging

Program management

Stakeholder management

Cross-functional leadership

Cost modeling

Quality systems

Education

Bachelor’s degree in Engineering, Electrical, Mechanical, Materials or Industrial

Master’s degree in Engineering, Operations, or MBA

Job description

Role Overview

The Program Manager – OSAT is responsible for leading large, complex customer programs from concept through high-volume manufacturing. This role serves as the single point of accountability for program execution—integrating customer requirements, engineering development, supply chain, and factory operations to ensure on-time, on-cost, and on-quality delivery.

A major focus of this position is operations readiness for new products (NPI to HVM transition), including capacity planning, qualification, ramp management, and alignment of cross-functional teams within an outsourced semiconductor assembly and test environment.

Key Responsibilities

Program Leadership & Execution

• Own end-to-end execution of multiple customer programs within the OSAT business unit.
• Act as the primary interface between customers and internal organizations (Technology Development, Factory NPI and Process Engineering, Operations/Manufacturing, Quality, Supply Chain, and Finance).
• Develop and maintain integrated program schedules, milestones, and deliverables.
• Drive structured program governance: stage gates, risk reviews, and executive reporting.
• Manage program financials including cost optimisation models, margins, and change management.

Customer Engagement

• Lead customer technical and business reviews, ensuring alignment on scope, schedule, and performance.
• Translate customer requirements into actionable internal plans.
• Manage customer escalations and ensure rapid issue resolution.
• Support commercial teams in RFQs, SOWs, and new business opportunities.

Operations Readiness & NPI

• Lead NPI to HVM transition activities including:
• Factory readiness (equipment, capacity, tooling, materials)
• Qualification planning (DOE, reliability, process validation)
• Yield ramp strategies and learning cycles
• Coordinate process development, product engineering, and manufacturing teams.
• Ensure BOM, process flows, test programs, and quality controls are production-ready.

Cross-Functional Coordination

• Chair core team meetings and drive accountability across functions.
• Manage risk registers, mitigation plans, and contingency strategies.
• Partner with Industrial Engineering on line design, cycle time, and capacity modeling.
• Align with Quality on customer qualifications, audits, and compliance.

Continuous Improvement

• Establish program management best practices, KPIs, and dashboards.
• Drive lessons-learned and standardization across programs.
• Support digitalization of program tracking and factory execution.

Required Qualifications

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, Industrial) or related field.
• 15+ years of experience in semiconductor manufacturing, OSAT, or advanced packaging.
• Relevant years of experience in program/project management with direct customer ownership.
• Proven experience with:
• New Product Introduction (NPI) and HVM ramp
• Assembly & Test processes (wire bond, flip chip, WLCSP, BGA, SiP, etc.)
• Semiconductor quality systems (APQP, FMEA, Control Plans, 8D)
• Strong knowledge of:
• Manufacturing operations, capacity planning, and yield management
• Supply chain coordination and material readiness
• Cost modeling and program financial management
• Excellent stakeholder management and communication skills.
• Ability to influence cross-functional teams without direct authority.

Preferred Qualifications

• Master’s degree in Engineering, Operations, or MBA.
• Experience working directly in an OSAT or IDM ATM environment.
• PMP / PgMP / PRINCE2 certification.
• Hands‑on background in:
• Package development and reliability qualification
• Test engineering and product bring-up
• Factory automation and MES systems
• Experience with Tier-1 global customers in mobile, automotive, HPC, or networking.
• Six Sigma Green/Black Belt certification.