Technology Development Program Lead

Tata Electronics Limited; Vemagal; On-site; INR 4,000,000 - 6,000,000; Full time

Job summary

Tata Electronics Private Limited is seeking a seasoned TD-PM leader to drive end-to-end program execution for advanced packaging projects in a high‑volume environment. You will coordinate with FAE, customers and internal functions to ensure timelines, quality and budget.

The role requires 15+ years in OSAT, strong people leadership, and expertise in APQP, 8D, DOE, SPC, FMEA and OCAP; startup and HVM experience are a plus.

Qualifications

• 15+ years in OSAT environment handling flip chip / advanced packaging.
• Experience leading a team to achieve organizational goals; start-up and HVM experience a plus.
• In-depth tech development knowledge in a fast-paced environment using APQP.
• Proficient in coaching teams with 8D writing, DOE, SPC, FMEA, OCAP and Control Plan.
• Creative and results-driven, able to drive innovation and continuous learning.

Responsibilities

• Oversee end-to-end program execution from planning to completion.
• Initiate kickoff meetings with participants and drive weekly MOMs.
• Coordinate with functional groups and customers on new program planning and execution.
• Understand detailed technical requirements from FAE and Customer.
• Prepare required direct/indirect materials, tooling, documents and systems.
• Collaborate with process SMEs to qualify new equipment, tooling and materials.
• Provide daily progress updates and weekly internal reports.
• Use project management tools to structure projects, control progress and reporting.
• Own program execution and align on major decisions with internal stakeholders.
• Ensure targets for time, quality, cost and budget are achieved.
• Lead technical discussions with equipment partners for data-driven decisions.
• Mentor and manage the team’s performance and development.
• Coach engineers on installation, buy-off and qualification of new processes/products.
• Meet commit targets to customers and pass qualification on first attempt.
• Maintain real-time customer communication and cross-functional updates.

Skills

Leadership

Program mgmt

Stakeholder mgmt

APQP

8D

DOE

SPC

FMEA

OCAP

Innovation

Job description

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components. Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state‑of‑the‑art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high‑performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence. Tata Electronics is a subsidiary of the Tata Group. The Tata Group operates in more than 100 countries across six continents, with the mission "To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust."

Purpose of this Role:

To lead a team of TD‑PM team & Process Integration team on the execution of the whole program from front to end & co‑work with customer & NPI > Opn, overseeing all the TD customer programs. Responsible for interfacing with customer and internally coordinating with all function groups, for all the customer programs loaded.

Responsibilities:

• Follow through new program management execution from start to end, responsible for overseeing the project from initial planning and design to completion.
• Initiate kick‑off meeting with all the relevant participants inside, to cover in detail, take input, and follow up with weekly drives with MOM send out.
• Liaise with all the functional groups & customer related to the new program planning & execution.
• Understand the detailed technical requirements from FAE & Customer.
• Pre‑prepare all the required direct material, indirect materials & consumables, tooling, documents, systems.
• If totally brand‑new technology, co‑join to work with all the process SME's and other functional group. This might involve selection & qualifying new equipment / tooling / material / consumables, process flow… and follow through the availability.
• TD‑PM will be supported out from respective process SME's team on enabling the technical capability, run through the lot, preparing report.
• Expected to share daily progress in the meeting verbally and also submit internal weekly work progress report.
• Use project management tools to structure projects, control progress and for reporting and documentation.
• Fully own the program execution and respond to any related query; for major decision need to align internally.
• Fully responsible for all operational decisions in the project and for the successful achievement of all project targets (time, quality, cost and budget).
• Lead, define, initiate and engage in technical discussion with all equipment partners to gather relevant data, review and complete the analysis for final decision‑making.
• Mentor and manage entire team on the performance requirement, on the program execution.
• Coach and lead relatively young team of engineers on the installation, buy‑off and qualification of the entire established / new processes and products at different phases.
• Meet the commit target to customer on the execution of the program.
• Pass qualification on 1st attempt, meeting all the customer requirements & standards.
• Manage customer communication & updates in real time.
• Maintain seamless communication with all the functional groups required, involved in this project.

Required Experience:

• Minimum of 15 years of experience in a leading OSAT environment handling latest technology of flip chip and/or advanced packaging.
• Experience in leading a group or team of employees in the achievement of organizational goals is mandatory. Added advantage if both start‑up and HVM experienced.
• In‑depth knowledge in technology development in a fast‑paced environment using tools like APQP.
• Well versed with ability to coach teams with 8D writing, DOE, SPC, FMEA, OCAP and Control Plan with both preventive, corrective and systemic mindset.
• Passionate and creative in achieving what’s not possible via innovation and continuous learning.