ISP Program Manager

Tata Electronics Private Limited; Assam; On-site; INR 350,000 - 600,000; Full time

Job summary

Tata Electronics Private Limited is seeking a Program Manager - OSAT to lead large, complex customer programs from concept through high-volume manufacturing. This role ensures on-time, on-cost, and on-quality delivery while aligning cross-functional teams in an outsourced semiconductor assembly and test environment.

The candidate will drive NPI to HVM transitions, optimize production readiness, and manage program governance, cost models, and customer engagements across technology development,

Qualifications

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, Industrial) or related field.
• 15+ years of experience in semiconductor manufacturing, OSAT, or advanced packaging.
• Relevant years of experience in program/project management with direct customer ownership.
• Proven experience with:
• New Product Introduction (NPI) and HVM ramp
• Assembly & Test processes (wire bond, flip chip, WLCSP, BGA, SiP, etc.)
• Semiconductor quality systems (APQP, FMEA, Control Plans, 8D)
• Strong knowledge of:
• Manufacturing operations, capacity planning, and yield management
• Supply chain coordination and material readiness
• Cost modeling and program financial management
• Excellent stakeholder management and communication skills.
• Ability to influence cross-functional teams without direct authority.

Responsibilities

• Own end-to-end execution of multiple customer programs within the OSAT business unit.
• Act as the primary interface between customers and internal organizations (Technology Development, Factory NPI and Process Engineering, Operations/Manufacturing, Quality, Supply Chain, and Finance).
• Develop and maintain integrated program schedules, milestones, and deliverables.
• Drive structured program governance: stage gates, risk reviews, and executive reporting.
• Manage program financials including cost optimisation models, margins, and change management.
• Lead customer technical and business reviews, ensuring alignment on scope, schedule, and performance.
• Translate customer requirements into actionable internal plans.
• Manage customer escalations and ensure rapid issue resolution.
• Support commercial teams in RFQs, SOWs, and new business opportunities.
• Lead NPI to HVM transition activities including:
• Factory readiness (equipment, capacity, tooling, materials)
• Qualification planning (DOE, reliability, process validation)
• Yield ramp strategies and learning cycles
• Coordinate process development, product engineering, and manufacturing teams.
• Ensure BOM, process flows, test programs, and quality controls are production-ready.
• Chair core team meetings and drive accountability across functions.
• Manage risk registers, mitigation plans, and contingency strategies.
• Partner with Industrial Engineering on line design, cycle time, and capacity modeling.
• Align with Quality on customer qualifications, audits, and compliance.
• Establish program management best practices, KPIs, and dashboards.
• Drive lessons-learned and standardization across programs.
• Support digitalization of program tracking and factory execution.

Skills

Program management

NPI

HVM ramp

Stakeholder management

Communication

Cross-functional leadership

Cost modeling

Education

Bachelor’s degree in Engineering

Master’s degree in Engineering/MBA

Tools

MES systems

Job description

Role Overview

The Program Manager - OSAT is responsible for leading large, complex customer programs from concept through high-volume manufacturing. This role serves as the single point of accountability for program execution-integrating customer requirements, engineering development, supply chain, and factory operations to ensure on-time, on-cost, and on-quality delivery.

A major focus of this position is operations readiness for new products (NPI to HVM transition), including capacity planning, qualification, ramp management, and alignment of cross-functional teams within an outsourced semiconductor assembly and test environment.

Key Responsibilities

Program Leadership & Execution

• Own end-to-end execution of multiple customer programs within the OSAT business unit.
• Act as the primary interface between customers and internal organizations (Technology Development, Factory NPI and Process Engineering, Operations/Manufacturing, Quality, Supply Chain, and Finance).
• Develop and maintain integrated program schedules, milestones, and deliverables.
• Drive structured program governance: stage gates, risk reviews, and executive reporting.
• Manage program financials including cost optimisation models, margins, and change management.

Customer Engagement

• Lead customer technical and business reviews, ensuring alignment on scope, schedule, and performance.
• Translate customer requirements into actionable internal plans.
• Manage customer escalations and ensure rapid issue resolution.
• Support commercial teams in RFQs, SOWs, and new business opportunities.

Operations Readiness & NPI

• Lead NPI to HVM transition activities including:
• Factory readiness (equipment, capacity, tooling, materials)
• Qualification planning (DOE, reliability, process validation)
• Yield ramp strategies and learning cycles
• Coordinate process development, product engineering, and manufacturing teams.
• Ensure BOM, process flows, test programs, and quality controls are production-ready.

Cross-Functional Coordination

• Chair core team meetings and drive accountability across functions.
• Manage risk registers, mitigation plans, and contingency strategies.
• Partner with Industrial Engineering on line design, cycle time, and capacity modeling.
• Align with Quality on customer qualifications, audits, and compliance.

Continuous Improvement

• Establish program management best practices, KPIs, and dashboards.
• Drive lessons-learned and standardization across programs.
• Support digitalization of program tracking and factory execution.

Required Qualifications

• Bachelor’s degree in Engineering (Electrical, Mechanical, Materials, Industrial) or related field.
• 15+ years of experience in semiconductor manufacturing, OSAT, or advanced packaging.
• Relevant years of experience in program/project management with direct customer ownership.
• Proven experience with:
• New Product Introduction (NPI) and HVM ramp
• Assembly & Test processes (wire bond, flip chip, WLCSP, BGA, SiP, etc.)
• Semiconductor quality systems (APQP, FMEA, Control Plans, 8D)
• Strong knowledge of:
• Manufacturing operations, capacity planning, and yield management
• Supply chain coordination and material readiness
• Cost modeling and program financial management
• Excellent stakeholder management and communication skills.
• Ability to influence cross-functional teams without direct authority.

Preferred Qualifications

• Master’s degree in Engineering, Operations, or MBA.
• Experience working directly in an OSAT or IDM ATM environment.
• PMP / PgMP / PRINCE2 certification.
• Hands-on background in:
• Package development and reliability qualification
• Test engineering and product bring-up
• Factory automation and MES systems
• Experience with Tier-1 global customers in mobile, automotive, HPC, or networking.
• Six Sigma Green/Black Belt certification.