IC Packaging Staff Engineer - Assembly process/Characterization Bangalore, India Hardware Engin[...]

Qualcomm; Bengaluru; On-site; INR 2,500,000 - 4,500,000; Full time

Job summary

Qualcomm is seeking an IC Packaging Staff Engineer in Bengaluru to lead state-of-the-art packaging development and high-volume manufacturing deployment across AI, mobile, IoT, and automotive markets. You will own package process flows, material sets, DOEs, and cornering while collaborating with OSATs and suppliers.

The role requires strong experience in Flip Chip, Wire Bond, Laser Groove technology, and multi-functional leadership with a focus on reliability and cost optimization.

Qualifications

• Bachelor’s or higher degree with 4+ years hardware/IC packaging or related work.
• Experience with FCCSP, FCBGA, or SiP/Module packaging preferred.
• Experience leading multi-functional teams and interfacing with OSATs.

Responsibilities

• Develop and deploy high-volume manufacturing packaging for FCCSP/FCBGA/SiP.
• Define package process flows, materials, tests, DOEs, and control plans.
• Lead cross-functional teams and coordinate with OSATs and suppliers.
• Drive DFM and cost-down initiatives for new technologies.

Skills

Verbal and written communication

Project management

Packaging process optimization

Self-driven and creative

Education

Bachelor's in Electrical Engineering, Electronics or related

Master's or PhD in Electrical/Mechanical Engineering or related

Job description

## IC Packaging Staff Engineer - Assembly process/CharacterizationBangalore, IndiaApply NowFind out how well you match with this jobJob ID3082736## **Company:**Qualcomm India Private Limited## **Job Area:**Engineering Group, Engineering Group > Hardware Engineering**General Summary:**We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging development and new product introduction of leading-edge package technologies for AI, Mobile, Bluetooth, WiFi, IoT, Power Management, Connectivity Automotive and new emerging markets and driving that innovation into high volume manufacturing in assembly suppliers. Extensive knowledge and experience in Flip Chip, Wire bond and System in Package assembly process, materials, and equipment are required. The position also requires the ability to lead multi-functional teams and solve complex technical problems in working with multiple OSATs. Experience or worked on projects with Wafer-on-Wafer bonding is a plus.**Minimum Qualifications:**• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.Duties and Responsibilities:* Responsible for exploring, development and HVM deployment of FCCSP, FCBGA, and/or SiP/Module packaging technologies.* Responsible for initiating & defining package process flow, material set/ BKM, test vehicle, DOEs & cornering, process control plans to successfully develop manufacturable and reliable products.* Interface with OSATs, substrate/ material suppliers, and tool makers in developing technology related to product requirements. Align with internal product teams on Design Rule and its establishment.* Associate with internal design team and drive DFM methodology for new technologies.* Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging.* Technical program management to plan, execute, and monitor complex processes or product developments. Regular updates on program status to management and share with cross team members.* Good knowledge and understanding of FMEA, SPC/QC concepts, failure mechanism and failure analysis process techniques, manufacturing floor operations and Quality issue handling.Minimum Qualifications* Minimum of 10 years of experience in the development and high-volume manufacturing of advanced IC packages.* Expertise in Flip Chip CSP, FCBGA and SiP packaging materials, assembly processes, equipment, and design rules.* Strong understanding of Laser Groove technology and Wire bond process optimization.* Excellent verbal and written communication skills.* Exhibit organized technical project management skills.* Able to work independently and lead multiple programs.* Able to lead multi-functional teams to solve complex technical problems.* Self-driven, passionate, and creative.Preferred Qualifications* Hands on experience in package manufacturing, experience in technical project management, and working first-hand with semiconductor material suppliers.* Understanding industry packaging trends, end-user packaging considerations, and previous experience with high-end mobile consumer products.* Proficiency in material and package characterization and statistical data analysis.* Knowledge of reliability test methods and qualification procedure.* Six Sigma Green or Black belt a plus.Educational Requirements* Required: Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related degree or equivalent practical experience.* Preferred: Master's degree or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, related Engineering field.**Applicants**: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [e-mail] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. 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