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Luxoft is seeking an IP Packaging Engineer to be onsite at AMD Hyderabad. The role involves packaging, validating and releasing IP blocks used across chip design projects, and debugging multi-component packaging and build/DV flows. You will coordinate findings with US-based counterparts across time zones.
The ideal candidate has 1–2 years of relevant experience, solid understanding of RTL-based design and verification, and strong Python/Shell scripting skills. Onsite work is required.
This is a great opportunity to work as part of a highly regarded team to deliver leading-edge solutions.