Engineer- Multi-Physics Sign-off (Timing, PDN & Thermal)

Arm; Bengaluru; Hybrid; INR 3,500,000 - 5,500,000; Full time

Job summary

Arm is seeking a CAD & Methodology Engineer to develop and support 3DIC and 2.5D physical design methodologies for advanced multi-die systems. You will build scalable, production-ready flows spanning timing, power, IR/EM, ESD, thermal, CFD/FEM, and multiphysics analyses, collaborating with PD, packaging, PI, reliability, and EDA vendors.

The ideal candidate has hands-on experience with advanced-node implementation, strong scripting, and ownership of flows, working across teams to deliver robust

Qualifications

• VLSI knowledge essential and MUST
• Minimum 5+ years of System Level experience
• Strong hands-on experience with 3DIC and/or 2.5D designs
• Familiarity with chiplet-based designs and system-in-package tradeoffs

Responsibilities

• Develop, maintain, and qualify CAD flows for 3DIC/2.5D designs including chiplets and interposers
• Enable end-to-end implementation and signoff methodologies from floor planning to tapeout
• Support die-to-die connectivity and cross-die constraint management
• Collaborate with design and packaging teams to integrate package-aware considerations into PD flows
• Develop STA methodologies for multi-die designs and cross-die timing
• Enable power analysis and EM signoff flows for 2.5D/3DIC
• Define ESD verification guidelines in advanced packaging
• Tool qualification, correlation, and signoff criteria definition

Skills

VLSI Knowledge

System Level Experience

3DIC / 2.5D Experience

Chiplet-based Designs

Tools

Cadence 3D-IC

Synopsys 3DIC Compiler

Cadence Celsius Thermal Solver

Ansys Icepak

Ansys RHSC-ET

Job description

We are seeking a CAD & Methodology Engineer to develop, enable, and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems. This role focuses on building robust, scalable, and production-ready flows spanning timing, power, IR/EM, ESD, thermal, CFD/FEM, and multiphysics analysis, in close collaboration with physical design, package, PI, reliability, and EDA vendor teams.

The ideal candidate brings hands-on understanding of advanced-node implementation and signoff, combined with strong scripting, flow ownership, and cross-team collaboration skills.

Responsibilities

This is a hand-on role for delivering tool-flow-methodology and automation.

3DIC / 2.5D CAD Flow Development

• Develop, maintain, and qualify CAD flows for 3DIC and 2.5D designs, including chiplets, interposers, and advanced packaging technologies
• Enable end-to-end implementation and signoff methodologies covering floor planning through tapeout
• Support die-to-die connectivity, bump/TSV-aware flows, and cross-die constraint management
• Work with design and packaging teams to integrate package-aware and system-aware considerations into PD flows

Timing, Power, and Reliability Methodology

• Develop and support STA methodologies for multi-die designs, including cross-die timing, constraints, and closure strategies
• Enable power analysis, IR drop, and EM signoff flows for 2.5D and 3DIC systems
• Define guidelines for ESD verification in advanced packaging contexts
• Assist with tool qualification, correlation, and signoff criteria definition

Thermal, CFD, and Multiphysics Methodology

• Develop and support thermal analysis methodologies for 3DIC and 2.5D designs
• Enable CFD/FEM-based thermal analysis to model conduction, convection, and airflow effects from die to package to system
• Support coupled electro-thermal and Multiphysics flows, integrating power, thermal, and reliability analysis
• Partner with design and package teams to incorporate thermal considerations early in the design flow

Automation, Infrastructure, and Enablement

• Build and maintain automation, scripts, and checks to improve flow robustness, runtime, and usability
• Develop documentation, examples, and training materials for design teams
• Debug flow issues and provide CAD support during active design cycles
• Drive continuous improvement based on user feedback and silicon takeaways

Teamwork and Vendor Engagement

• Work closely with physical design, package, PI, reliability, and silicon teams
• Collaborate with EDA vendors to evaluate new tools, features, and roadmap items
• Support tool upgrades, regressions, and flow migrations across projects

Required Skills and Experience :

• VLSI Knowledge MUST
• Minimum 5+ years of System Level experience
• Strong hands-on experience with 3DIC and/or 2.5D designs
• Familiarity with chiplet-based designs, system-in-package designs and tradeoffs involved

Nice To Have Skills and Experience :

• Experience with TSVs, micro-bumps, interposers, and advanced packaging technologies
• Familiarity with industry-standard EDA tools for 3DIC implementation and signoff
• Cadence Integrity 3D-IC
• Synopsys 3DIC Compiler
• Cadence Celsius Thermal Solver
• Ansys Icepak
• Ansys RHSC-ET

Accommodations at Arm

At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email [e-mail] . To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.

Hybrid Working at Arm

Arm’s approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team’s needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.

Equal Opportunities at Arm

Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don’t discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.