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Qualcomm India Private Limited is seeking experienced ASIC Physical Design Engineers to join the Snapdragon CPU team. You will drive block-level physical design from RTL to GDSII for high-performance SoCs in sub-10nm technology, focusing on PPA, timing, and signoff.
The role requires 7+ years in ASIC Physical Design with Cadence Innovus and Synopsys Fusion tools, collaborating with RTL, Synthesis, STA, and Verification teams, and strong scripting skills in Tcl/Python.
Job Description:
Company: Qualcomm India Private Limited
Job Area: Engineering Group, Engineering Group > Hardware Engineering
General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
We are looking for bright and highly motivated ASIC Physical Design Engineers with strong analytical and technical skills to join our Snapdragon CPU team. This is an exciting opportunity to work on high-performance CPU designs for advanced SoCs in sub-10nm technologies targeting Mobile, Compute, and IoT products. Similar responsibilities are reflected in internal CPU Physical Design roles focused on RTL-to-GDSII implementation, PPA optimization, timing closure, and advanced-node design.
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