Chip Integration Design Lead

Broadcom; Bengaluru; On-site; INR 1,800,000 - 3,200,000; Full time

Job summary

Broadcom is seeking a Chip Integration Design Lead in Bengaluru, India, to steer the integration of advanced ASIC chips. The role requires close collaboration with block design, DV, IP, PD, uArch, SW and board design teams to ensure successful tape-out and performance optimization.

The candidate will oversee end-to-end design activities, from high-level design assessment through synthesis, place-and-route, and timing/power optimization, delivering cutting-edge semiconductor solutions.

Responsibilities

• Design Lead for Chip Integration with cross-functional teams to execute complex cutting edge ASIC chips.
• Evaluates all aspects of the process flow from high-level design to synthesis, place and route, and timing and power use.

Job description

Chip Integration Design Lead at Broadcom

Job Description

Design Lead for Chip Integration working closely with other functional teams (block design, DV, IP, PD, uArch, SW, Board Design) to execute complex cutting edge ASIC chips. Evaluates all aspects of the process flow from high-level design to synthesis, place and route, and timing and power use.

R026777

Seniority level

• Mid-Senior level

Employment type

• Full-time

Job function

• Design, Art/Creative, and Information Technology

Industries

• Semiconductor Manufacturing