Chip Architect

NXP Semiconductors NV; Pune District; On-site; INR 3,000,000 - 6,000,000; Full time

Job summary

NXP Semiconductors NV in India is seeking an experienced IC Architect to define and deliver cutting-edge SoC architectures for next-generation products. You will translate product requirements into robust architectures, balancing performance, power, area, and cost while guiding design teams through tape-out and production.

You will lead architecture definition, mentor engineers, collaborate with product managers and customers, and coordinate with local and remote teams to ensure successful

Qualifications

• Experience in IC architecture for SoC products.
• Ability to translate product requirements into detailed design specifications.
• Leadership to guide design teams and drive tape-out readiness.

Responsibilities

• Architect the overall IC structure, including digital, analog, and mixed-signal blocks.
• Translate high-level product specifications into detailed requirements for design teams.
• Balance trade-offs in performance, power, area, and cost to meet product goals.
• Collaborate with product managers, software architects, and customers to clarify requirements; align with project managers on resources and milestones.
• Mentor and guide design engineers and sub-system architects throughout development and implementation.
• Define technical interfaces and ensure alignment with external suppliers.
• Support structured project execution and maintain communication with local and remote teams.
• Drive end-to-end chip delivery—from concept and specification to tape-out and production.

Skills

IC Architect

SoC Architecture

Leadership

Cross-functional collaboration

Job description

An experienced IC Architect defines and delivers cutting-edge systems-on-chip (SoC) architectures for next-generation products. In this role, he translates product requirements into a robust architecture, balancing performance, power, area, and cost. He leads the architecture definition, guide design teams, and ensure successful tape-out and production.

Key Responsibilities

• Architecture Definition: Architect the overall IC structure, including digital, analog, and mixed-signal blocks (in collaboration with analog IC architect) and test strategy.
• Requirements Translation: Convert high-level product specifications into detailed technical requirements for design teams.
• System-Level Optimization: Balance trade-offs in performance, power, area, and cost to meet product goals.
• Cross-Functional Collaboration: Work closely with product managers, software architects, and customers to clarify customer requirements; align with project managers on resources, schedules, and milestones.
• Technical Leadership: Mentor and guide design engineers and sub-system architects throughout development and implementation.
• Supplier & Partner Interaction: Define technical interfaces and ensure alignment with external suppliers.
• Project Governance: Support structured project execution and maintain communication with local and remote teams.
• Expertise Application: Drive end-to-end chip delivery—from concept and specification to tape-out and then towards qualification and production.

More information about NXP in India…