Assembly Equipment & Process Engineer | Micron Technology – India

NanoHelp; Sanand; On-site; INR 800,000 - 1,200,000; Full time

Benefits offered by this job

Competitive salary

Health benefits

Professional development opportunities

Job summary

A global semiconductor leader in Sanand, Gujarat is seeking a talented Process & Equipment Engineer for Assembly to optimize materials, equipment, and techniques in wafer dicing. The role supports advanced memory packaging and requires strong problem-solving skills and hands-on experience. Ideal candidates have a B.E., M.Tech, or Ph.D. in relevant fields with expertise in FMEA, SPC, and DOE. This position offers a competitive salary with benefits and opportunities for professional growth.

Qualifications

• Hands-on experience with wafer dicing processes.
• Knowledge of statistical tools (FMEA, SPC, DOE).
• Strong problem-solving and root cause analysis capabilities.

Responsibilities

• Evaluate and optimize assembly materials, equipment, and processes.
• Apply DOE, FMEA, and SPC techniques for robust yield improvement.
• Implement failure analysis and risk mitigation strategies.
• Define and document standard operating procedures.
• Lead process qualification and handle supplier audits.

Skills

Wafer Dicing

Problem-solving

Root Cause Analysis

FMEA

SPC

DOE

Teamwork

Communication

Education

B.E. or M.Tech or Ph.D. in Mechatronics, Mechanical, Electronics

Job description

Assembly Equipment & Process Engineer | Micron Technology – India

Drive cutting-edge assembly process innovation at Micron’s Sanand facility

Micron India is seeking a talented Engineer for Assembly Equipment & Process to optimize materials, equipment, and techniques in wafer dicing and advanced memory packaging at its Sanand campus.

Job Details

Title: Engineer, ASSY Equipment & Process

Organization: Micron Technology, Inc.

Work Location: Sanand, Gujarat, India

Research Field: Nanotechnology, Electronics, Electrical Engineering, Mechanical Engineering, Applied Physics, Mechatronics

Application Deadline: Rolling

Posted Date: July 2025

Funding Type: Industry (Micron Technology)

Researcher Profile: Entry-level to mid-career engineer with process and equipment optimization skills

Required Qualification: B.E., M.Tech, or Ph.D. in relevant fields

Required Experience: Wafer Dicing, FMEA, SPC, DOE preferred

Salary: Competitive with benefits

Micron Technology, a global semiconductor leader, is hiring a Process & Equipment Engineer for Assembly (ASSY) in Sanand, Gujarat. This role supports cutting-edge memory packaging and assembly lines, with a focus on wafer dicing, yield enhancement, and risk-managed innovation.

As an ASSY engineer, you’ll be responsible for starting up, stabilizing, and optimizing equipment/process flows, while ensuring quality, cost control, and throughput excellence.

Responsibilities

• Evaluate and optimize assembly materials, equipment, and processes
• Apply DOE, FMEA, and SPC techniques for robust yield improvement
• Implement failure analysis and risk mitigation strategies
• Define and document standard operating procedures
• Lead process qualification and handle supplier audits

Ideal Candidate Profile

• B.E., M.Tech, or Ph.D. in Mechatronics, Mechanical, Electronics, or related fields
• Hands-on experience with wafer dicing processes
• Knowledge of statistical tools (FMEA, SPC, DOE)
• Strong problem-solving and root cause analysis capabilities
• Team-oriented with strong communication skills

This position is a great opportunity to work at the intersection of nanomanufacturing and assembly engineering, applying advanced methods to improve reliability, reduce costs, and enhance productivity in next-gen memory product development.

Disclaimer: Micron never charges recruitment fees or solicits payments from candidates. Ensure that all application information, including AI-assisted documents, is accurate and truthful. Misrepresentation will lead to disqualification.

Micron is an equal opportunities employer and welcomes applications from all qualified candidates.